High Frequency High TG FR4 Keyboard Fast PCB Assembly 700*460mm

Prototype Assembly Drawing Fast Turn Turnkey PCB Assembly Electronics Components

CESGATE's Advantages of Turnkey PCB Assembly

Our company currently has 7 wave soldering production lines and 10 post-DIP soldering lines. We can make special fixtures according to customer requirements and product conditions to ensure product reliability and effectively improve plug-in efficiency.

Our DIP post-welding personnel have rich experience, and have formulated detailed standardized operation guidelines and SOP operation instructions to meet the high-quality requirements of high-end customers.

Test each function of the product according to the test case, and provide the test report. We can provide services such as electrical measurement and aging according to customer needs to improve product reliability.
For each process, CESGATE has formulated perfect operation instructions, and customized targeted inspection standards according to products in different industries, so as to improve the pass-through rate of products from each link.

Who Are We

• PCB manufacturer located in Chengdu.
• Over 300 total staff
• 25,000sqm production capacity
• Advanced automatic production equipments
• Offers various kinds PCBs, small to medium to mass quantity orders
• Major markets include domestic China, Asia, Europe and North America
• Customers include OEM/ODM factories, Turnkey PCB Assembly factories, EMS, trading companies

SMT Turnkey PCB Assembly Quality Control

①Adhesive cardboard: Test whether the SMT placement position is correct, greatly reduce the SMT trial production time and the waste of components, and effectively ensure the quality of SMT
②Intelligent first-piece detector: detects wrong materials, missing parts, polarity, orientation, silk screen, etc., mainly used in the detection of first-piece; compared with manual detection, the accuracy is higher and the speed is increased by 50%+
③SPI-Automatic 3D Solder Paste Thickness Gauge: Detects various solder paste printing quality problems such as missing printing, less tin, more tin, continuous tin, offset, poor shape, board surface pollution, etc.
④AOI: Detect various problems after placement: short circuit, material leakage, polarity, displacement, wrong parts
⑤Xray: Open circuit and short circuit detection of BGA, QFN and other devices.

Specification

FAQ