China Semiconductor Packaing Tape manufacturer
Shenzhen KHJ Technology Co., Ltd
Semiconductor Processing Tapes Solution Provider
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Thermal Release Tape-TS600D

Thermal Release Tape-TS600D

Brand Name KHJ
Model Number TS600D
Place of Origin China
Detailed Product Description

 

Description


TS600D is a Blue thermal release tape with high initial viscosity. At (105-110℃), The stickiness of the adhesive surface disappears and automatic separation from the object to be adhered can be achieved.

 

 

Construction


 

Features

●  Easily peeled off by heat treatment at any time
●  Initial temperature resistance and will not re-tack
●  RoHS Compliant
 
Application

This product is suitable for temporarily fixing various types of components,
ceramics, glass, metal plates, etc., and is suitable for various electronic
industry specialties. kind of cutting protection
 
Properties

ItemTypical ValueTest Method
ImperialMetric
Backing4.0mil0.1mm/
Total Thickness6.1mil0.155±0.005mm/

Adhesion
Before heating0.44-1.1lbs/in2-5 N/25mmGBT 2792-2014
After heating00
Tensile Strength≥55bs/in≥3.5(KN/M)GBT 30776-2014
Elongation≥120%≥120%GBT 30776-2014

 

Recommended debonding process: 110℃*4-15min(based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)

 

Storage


● Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

● Shelf life: 12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder


● Surface should be clean, dry, free of dust, oil or other contaminants.

● Proper pressure required by roller, hand or press when applying.

● Avoid repeat sticking to prevent adhesion decrease.

 

Notes


Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

 
 
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