1.4mm Thickness RFID LED Card Oversight Radio Frequency Transceiver

1.4mm Thickness Active SmartCard Oversight Radio Frequency Transceiver

Low power passive boot Active SmartCard oversight radio frequency transceiver

Product introduction: The dynamic smart card of the technology, using the cold pressure process, on the basis of the PCBA smart card, plus specific animations, with the designed personalized version of the design, is present on a smart card, and has born a leading industry. New Products --- Colorful smart card, card animation color reaches 10 or more, display content is reflected in text, graphics logo, letters. The animation logo on the card can illuminate. The card uses F50 / F08 and other high-security RFID chips, and the finished product is packaged into a colorful smart card with a thickness of 0.9-1.4mm. It can be customized for the use of VIP membership cards, large-scale event commemorative cards, and personalized identification cards for special occasions (bus cards, big enterprise units).smart business cards

PCBA card sealing process: packaging PCBA into smart card has been a technical difficulty in the smart card industry for many years. The high-temperature melting PVC method used in the traditional smart card manufacturing process can no longer meet the PCBA circuit board business card printing. The high temperature of the traditional process will lead to problems such as lithium battery failure and component damage. Heyang technology began to establish a special scientific research team in 2014, Tackling the PCBA card sealing technology, through continuous research, we have developed the relevant technologies and equipment for PCBA card sealing and the corresponding glue formula. Using the PCBA card sealing technology achievements of Heyang for many years, we have successfully encapsulated the ultra-thin lithium battery, chip, solar panel, fingerprint, ink screen and other components or modules with high performance, high reliability and flat appearance at room temperature The daily production capacity of high-end smart cards that meet the bending test standards has reached 20000-30000 PCs. with the continuous efforts of Heyang, the production capacity, process and performance have been gradually improved and improved.