2 Layer Flex Pcb Printed Circuit Board Assembly Bonding

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Quanhong FASTPCB

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18820288062

Contact Person:
Mr.Yu View Contact Details

2 Layer Flex Pcb Printed Circuit Board Assembly Bonding

Brand Name	FASTPCB
Place of Origin	CHINA
Minimum Order Quantity	10PCS
Price	USD 0.01-100PCS
Payment Terms	L/C, T/T
Supply Ability	25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Packaging Details	Inner: vacuum packing or Anti-static package, Outer: export carton
PCB	Double Sided Bonding Printed Circuit Board
Base Material	FR-4
Number of Layers	2 Layer
Board Thickness	1.6mm
Min. Hole Size	0.25mm
Min. Line Width	0.1mm
Min. Line Spacing	0.1mm
Solder Mask Color	Green
surface treatment	Immersion gold
Copper thickness	1 OZ.

Detailed Product Description

Double Sided Bonding Printed Circuit Board

The Double Sided Bonding Printed Circuit Board is the rigidity PCB circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. the printed circuit board is made of FR-4 material, surface gold deposition and laser drilling. The minimum line width and line spacing can reach 75um and the minimum hole diameter can reach 0.1mm. The buried blind hole circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic products and automotive electronics.

Process capability

Item		HLC Advanced Technology
Item		2019	2020	2021
Max Panel Width (inch)		25	25	25
Max Panel Length (inch)		29	29	29
Max Layer Count (L)		16	18	36
Max Board thickness (mm)		3.2	4	6
Max Board thickness Tolerance		+/-10%	+/-10%	+/-10%
Base copper Thickness	Inner layer ( OZ )	4	6	8
Base copper Thickness	Outer Layer ( OZ )	2	3	4
Min DHS ( mm )		0.2	0.15	0.15
PTH Size Tolerance ( mil )		+/-2	+/-2	+/-2
Back Drill (stub)( mil )		~ 3	~ 2.4	~ 2
Max. AR		12:1	16:1	20:1
Item		HLC Advanced Technology
Item		2019	2020	2021
M-drill tolerance	Inner layer ( mil )	DHS + 10	DHS + 10	DHS + 8
M-drill tolerance	Outer Layer ( mil )	DHS + 8	DHS + 8	DHS + 6
Solder mask Registration (um)		+/- 40	+/- 30	+/- 25
Impedance control	≥50ohms	+/-10%	+/-10%	-/-8%
Impedance control	<50ohms	5 Ω	5 Ω	4 Ω
Min LW/S (Inner)@1oz base Cu ( mil )		3.0 / 3.0	2.6 / 2.6	2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil )		3.5 / 3.5	3.0 / 3.5	3.0 / 3.0
Max dimple for POFV ( um )		30	20	15
Surface Finishing		ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

Item		HDI Advanced Technology
Item		2019	2020	2021
Structure		5+n+5	6+n+6	7+n+7
HDI Stack Via		AnyLayer(12L)	AnyLayer(14L)	AnyLayer(16L)
Board Thickness(mm)	Min. 8L	0.45	0.4	0.35
	Min. 10L	0.55	0.45	0.4
	Min. 12L	0.65	0.6	0.55
	MAX.		2.4
Min. Core Thickness ( um )		50	40	40
Min. PP Thickness ( um )		30(#1027PP)	25(#1017PP)	20(#1010PP)
Base Copper Thickness	Inner Layer ( OZ)	1/3 ~ 2	1/3 ~ 2	1/3 ~ 2
Base Copper Thickness	Outer Layer ( OZ )	1/3 ~ 1	1/3 ~ 1	1/3 ~ 1
Item		HDI Advanced Technology
Item		2019	2020	2021
Min. Mechanical Drill hole size(um) **		200	200	150
Max. Through Hole Aspect Ratio *		8:1	10:1	10:1
Min. Laser via/Pad Size ( um )		75/200	70/170	60/150
Max. Laser Via Aspect Ratio		0.8:1	0.8:1	0.8:1
Laser Via on PTH(VOP)design		Yes	Yes	Yes
Laser X type through hole(DT≤200um)		NA	60~100um	60~100um
Min. LW/S (L/S/Cu, um)	Inner Layer	45 /45 /15	40/ 40/ 15	30/ 30 /15
Min. LW/S (L/S/Cu, um)	outer Layer	50 /50/ 20	40 /50 /20	40 /40 /17
Min BGA Pitch (mm)		0.35	0.3	0.3
Item		HDI Advanced Technology
Item		2019	2020	2021
Solder mask Registration (um)		+/- 30	+/- 25	+/- 20
Min. Solder Mask Dam (mm)		0.07	0.06	0.05
PCB Warpage Control	>= 50ohm	+/-10%	+/-8%	+/- 5%
PCB Warpage Control	< 50ohm	+/- 5ohm	+/- 3ohm	+/- 3ohm
PCB Warpage Control		≤0.5%	≤0.5%	≤0.5%
cavity Depth accuracy (um)	Mechanical	+/- 75	+/- 75	+/- 50
cavity Depth accuracy (um)	Laser directly	+/- 50	+/- 50	+/- 50
Surface Finishing		OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag	OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

Packaging & Delivery
Packaging Details:	Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement.
Port:	Shenzhen or Hongkong
Lead Time:	Quantity(Pieces)	1-10	11-100	101-1000	>1000
	Est. Time(days)	20	21	25	To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Product Tags: 2 Layer Flex Pcb Printed Circuit Board Flex Pcb Printed Circuit Board Assembly 2 layer pcb board

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