12 Layer Flexible Printed Circuit Board + FR4 Stiffener
The 12 Layer Flexible Printed Circuit Board + FR4 Stiffener is a
flexible printed circuit board developed and produced by Shenzhen
Quanhong Electronics Co., Ltd. It is a printed circuit made of
flexible insulating substrate, which has many advantages that hard
printed circuit boards do not have. Using FPC can greatly reduce
the volume of electronic products, which is suitable for the
development of electronic products in the direction of high
density, miniaturization and high reliability. Therefore, FPC has
been widely used in aerospace, military, mobile communication,
laptop, computer peripherals, PDA, digital camera and other fields
or products.
Flex & Rigid-Flex Technology
| Item | Flex & Rigid-Flex Technology |
| 2019 | 2020 |
| Flex Layer Count | 6 | 8 |
| Roll Width/PNL Size( mm ) | Roll Width (inner layer) | 250 | 500 |
| Working PNL Size | 250 x 250 ~ 500 | 500 x 610 |
| Min Line / Space ( um ) | Inner layer with CF | 40 /40 / 12 | 35 /35 /12 |
| (L/S/Cu thickness) | 50 /50 /18 | 45 /45 /18 |
| | Outer layer with plated Cu | 55 /55 / 25 | 50 /50 /25 |
| | 63 /63 /35 | 55 /55 /35 |
| Via Structure | Laser blind via size (um) | 75 | 65 |
| Stacked via structure | Y | Y |
| Laser through via ( um ) | 100 | 75 |
| M-drill hole size ( um ) | 150 | 100 |
| Min Pad size ( um ) | Inner layer with CF | D + 225 | D + 175 |
| Outer layer with plated Cu | D + 200 | D + 150 |
| Button plating | D + 250 | D + 200 |
| Item | Flex & Rigid-Flex Technology |
| 2019 | 2020 |
| Cover-layer ( um ) | Registration | +/- 150 | +/- 125 |
| Solder mask ( um ) | Registration | +/- 50 | +/- 37.5 |
| Dam capability | 100 | 75 |
| E-test SMT pitch ( um ) | Dam capability | 200 | 150 |
| Flying probe | 100 | 100 |
| Rigid-Flex Technology | Flying probe | Up to 4 w air gap | Up to 4 w air gap |
| Rigid-Flex layer count | Up to 12 | Up to 16 |
| Max. Rigid-Flex PNL size ( mm ) | ~ 250 x 400 | ~ 500 x 610 |
| Max. Rigid-Flex PNL size ( mm ) | 25 | 12 |
| Min rigid layer thickness ( um ) | # 1037 & # 1027 | # 1017 |
| Surface finishing | ENIG, ENEPIG, Hard Au, OSP
|
Packaging & Delivery |
Packaging Details: | Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement. |
Port: | Shenzhen or Hongkong |
Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 3-5 | 3-5 | 7-9 | To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and
other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing
Street, Bao 'an District, Shenzhen, Guangdong province, China
