12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm

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Quanhong FASTPCB

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18820288062

Contact Person:
Mr.Yu View Contact Details

12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm

Brand Name	FASTPCB
Minimum Order Quantity	10PCS
Price	USD 0.01-100PCS
Payment Terms	L/C, T/T
Supply Ability	25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Packaging Details	Inner: vacuum packing or Anti-static package, Outer: export carton
PCB	Mobile Phone 3rd Order HDI PCB
Base Material	SY S1000-2M
Number of Layers	12Layer
Board Thickness	1.2mm+/-10%
Min. Line Width	0.065mm（2.5mil）
Surface Finishing	Immersion Gold+OSP
Minimum plate thickness aperture ratio	8:1
Min. Hole Size	Laser hole: 0.1mm

Detailed Product Description

Mobile Phone 3rd Order HDI PCB

The third-order HDI board of mobile phone is one of the series of third-order HDI PCB boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of Shengyi s1000-2m material through surface gold deposition, laser drilling and OSP. The minimum line width and line spacing are 65 / 65um and 0.1mm respectively. The HDI circuit board is widely used in the field of smart phones.

Rigid PCB Manufacturing Capability

Rigid PCB Manufacturing Capability
Rigid PCB Manufacturing Capability
Item	PCB	HDI
Layer	1-40	1-40
Minimum linewidth/linespacing	3MIL/3MIL(0.075mm)	2MIL/2MIL(0.05MM)
Minimum hole diameter	6MIL(0.15MM)	6MIL(0.15MM)
Minimum solder resist opening (single-side)	1.5MIL(0.0375MM)	1.2MIL(0.03MM)
Minimum solder resist bridge	3MIL(0.075MM)	2.2MIL(0.055MM)
Maximum aspect Ratio (thickness/hole diameter)	10:01	8:01
Impedance control accuracy	+/-8%	+/-8%
Finished thickness	0.3-3.2MM	0.2-3.2MM
Maximum board size	630MM*620MM	620MM*544MM
Maximum finished copper thickness	6OZ(210UM)	2OZ(70UM)
Minimum board thickness	6MIL(0.15MM)	3MIL(0.076MM)
Maximum layer	14层	12层
Surface treatment	HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag	Immersion Gold,OSP,selectiveimmersion gold,
Surface treatment	HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag	carbon print
Min/max laser hole size	/	3MIL / 9.8MIL
Laser hole size tolerance	/	10%

Packaging & Delivery
Packaging Details:	Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement.
Port:	Shenzhen or Hongkong
Lead Time:	Quantity(Pieces)	1-10	11-100	101-1000	>1000
	Est. Time(days)	20	21	25	To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Product Tags: 12 Layer Mobile Phone Pcb Boards 1.6mm FASTPCB mobile phone pcb design 1.6mm FASTPCB 12 layer pcb thickness 1.6mm

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