High Level Backplane PCB Printed Circuit Board 5mm 20 Layer Server Grade

Browse Categories

Quanhong FASTPCB

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18820288062

Contact Person:
Mr.Yu View Contact Details

High Level Backplane PCB Printed Circuit Board 5mm 20 Layer Server Grade

Brand Name	FASTPCB
Place of Origin	CHINA
Minimum Order Quantity	10PCS
Price	USD 0.01-100/PCS
Payment Terms	L/C, T/T
Supply Ability	25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Packaging Details	Corrugated case
PCB type	20 Layer Server High-Level Backplane PCB
Base Material	TU-872
Number of Layers	20 Layer
Copper Thickness	1Oz.
Board Thickness	5.0mm+/-10%
Min. Hole Size	0.25mm
Min. Line Width	0.075mm(3mil)
Min. Line Spacing	0.075mm(3mil)
Surface Finishing	ENIG
Solder Mask Color	Green
Minimum plate thickness aperture ratio	12:1

Detailed Product Description

20 Layer Server High-Level Backplane PCB

The 20 layer server high-level backplane PCB is a 20 layer PCB developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is produced by TUC(taiyao) tu872slk material and surface gold deposition technology. The PCB is widely used in the data center server PCB backplane.

HLC Process capability

Item		HLC Advanced Technology
Item		2019	2020	2021
Max Panel Width (inch)		25	25	25
Max Panel Length (inch)		29	29	29
Max Layer Count (L)		16	18	36
Max Board thickness (mm)		3.2	4	6
Max Board thickness Tolerance		+/-10%	+/-10%	+/-10%
Base copper Thickness	Inner layer ( OZ )	4	6	8
Base copper Thickness	Outer Layer ( OZ )	2	3	4
Min DHS ( mm )		0.2	0.15	0.15
PTH Size Tolerance ( mil )		+/-2	+/-2	+/-2
Back Drill (stub)( mil )		~ 3	~ 2.4	~ 2
Max. AR		12:1	16:1	20:1
Item		HLC Advanced Technology
Item		2019	2020	2021
M-drill tolerance	Inner layer ( mil )	DHS + 10	DHS + 10	DHS + 8
M-drill tolerance	Outer Layer ( mil )	DHS + 8	DHS + 8	DHS + 6
Solder mask Registration (um)		+/- 40	+/- 30	+/- 25
Impedance control	≥50ohms	+/-10%	+/-10%	-/-8%
Impedance control	<50ohms	5 Ω	5 Ω	4 Ω
Min LW/S (Inner)@1oz base Cu ( mil )		3.0 / 3.0	2.6 / 2.6	2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil )		3.5 / 3.5	3.0 / 3.5	3.0 / 3.0
Max dimple for POFV ( um )		30	20	15
Surface Finishing		ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

Item		HDI Advanced Technology
Item		2019	2020	2021
Structure		5+n+5	6+n+6	7+n+7
HDI Stack Via		AnyLayer(12L)	AnyLayer(14L)	AnyLayer(16L)
Board Thickness(mm)	Min. 8L	0.45	0.4	0.35
	Min. 10L	0.55	0.45	0.4
	Min. 12L	0.65	0.6	0.55
	MAX.		2.4
Min. Core Thickness ( um )		50	40	40
Min. PP Thickness ( um )		30(#1027PP)	25(#1017PP)	20(#1010PP)
Base Copper Thickness	Inner Layer ( OZ)	1/3 ~ 2	1/3 ~ 2	1/3 ~ 2
Base Copper Thickness	Outer Layer ( OZ )	1/3 ~ 1	1/3 ~ 1	1/3 ~ 1
Item		HDI Advanced Technology
Item		2019	2020	2021
Min. Mechanical Drill hole size(um) **		200	200	150
Max. Through Hole Aspect Ratio *		8:1	10:1	10:1
Min. Laser via/Pad Size ( um )		75/200	70/170	60/150
Max. Laser Via Aspect Ratio		0.8:1	0.8:1	0.8:1
Laser Via on PTH(VOP)design		Yes	Yes	Yes
Laser X type through hole(DT≤200um)		NA	60~100um	60~100um
Min. LW/S (L/S/Cu, um)	Inner Layer	45 /45 /15	40/ 40/ 15	30/ 30 /15
Min. LW/S (L/S/Cu, um)	outer Layer	50 /50/ 20	40 /50 /20	40 /40 /17
Min BGA Pitch (mm)		0.35	0.3	0.3
Item		HDI Advanced Technology
Item		2019	2020	2021
Solder mask Registration (um)		+/- 30	+/- 25	+/- 20
Min. Solder Mask Dam (mm)		0.07	0.06	0.05
PCB Warpage Control	>= 50ohm	+/-10%	+/-8%	+/- 5%
PCB Warpage Control	< 50ohm	+/- 5ohm	+/- 3ohm	+/- 3ohm
PCB Warpage Control		≤0.5%	≤0.5%	≤0.5%
cavity Depth accuracy (um)	Mechanical	+/- 75	+/- 75	+/- 50
cavity Depth accuracy (um)	Laser directly	+/- 50	+/- 50	+/- 50
Surface Finishing		OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag	OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

Packaging & Delivery
Packaging Details:	Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement.
Port:	Shenzhen or Hongkong
Lead Time:	Quantity(Pieces)	1-10	11-100	101-1000	>1000
	Est. Time(days)	3-5	3-5	7-9	To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Product Tags: High Level Backplane PCB 5mm PCB Printed Circuit Board 5mm 20 Layer backplane pcb thickness

Related Products

2.0mm 6L Red Purple Solder Mask Pcb Process For Communication Terminal for sale


From:	Enter your Email please. Your email is incorrect!
To:	Quanhong FASTPCB
Subject:	Subject is empty!
Message:	Characters Remaining: (80/3000) Please enter 20 to 3000 characters to contact this supplier!

High Level Backplane PCB Printed Circuit Board 5mm 20 Layer Server Grade

High Level Backplane PCB Printed Circuit Board 5mm 20 Layer Server Grade

HLC Process capability

HDI Process capability

2.0mm 6L Red Purple Solder Mask Pcb Process For Communication Terminal

1 OZ Copper Clad Laminate Pcb Printed Circuit Board Material Fr4 Pcb Assembly

4.8mm 36 Layer Multi Layer Circuit Board Custom Pcb Printing

1.6mm 0.5 Oz Copper Pcb Printed Circuit Board Company For Digital Security

1/2 Oz Copper Prototype Pcb Printed Circuit Board Substrate For Mobile Phone

Blue Black Soldermask PCB Industrial Equipment 6 Layer Copper Clad Fr4 Board