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4mil High Density Interconnect PCB Board Fabrication FR4 TG170

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Huashengxin Circuit Limited

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+8618319054165-755-2330-5870

Contact Person:
Ms.Yang
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4mil High Density Interconnect PCB Board Fabrication FR4 TG170

Brand Name Huashengxin
Model Number 135464
Certification UL , ISO9001
Place of Origin China
Minimum Order Quantity 1pcs
Payment Terms T/T
Delivery Time fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Packaging Details vacuum
PCB Name 4L 1+N+1 High-Density Interconnector PCB
Marterial FR4 TG170
Surface finished Immersion gold
Board Thickness 2.0mm
Copper thickness 1/1/1/1OZ
Min.PCB track/gap: 4/4mil
Solder mask Green, two sides
Smallest Mechanical drilling hole: 0.2mm
Special requirement impedance control/high TG
Applicationcommunications products Communications products
Detailed Product Description

4mil High Density Interconnect PCB Board Fabrication FR4 TG170

 

HDI PCB Board PCB Prototype Board PCB Prototype Board HDI Board PCB Manufacturing Service FR4 PCB Board

 

4L 1+N+1 High-Density Interconnector Printed Circuit Boards


HDI stands for High-Density Interconnector. It is a special type of PCB that has the capability of high-density interconnections. It means that HDI boards has more wires or conduction lines per unit area, utilizing the most out of the space and offering a compact PCB.

HDI PCB has tightly packed interconnections, it saves a lot of space and offers more component density and it has the capability of making a circuit compact.

 

HDI boards are particularly attractive to portable, mobile, and portable electronics due to their slim, dependable performance and tiny size. HDI technology is a critical component of many of advanced technologies. The miniaturization of electronic components including PCBs has enabled manufacturers to produce smaller, more cost-effective devices without sacrificing performance or reliability.

 

They are largely used in Consumer Electronics, communication, Automotive and Aerospace,Medical Devices, and industry control products and other industries.

 

Circuit board Layer count:4LCircuit board laminate:FR4 TG170
Layer Copper thick:1/1/1/1OZBoard thickness:2.0MM
Smallest hole size:0.20mmSmallest PCB track/gap:4/4mil
Solder mask color:TAIYO GreenSilk screen color:White
PCB surface finished:Immersion GoldBoard profile:Routing
PCB Board Application:communications
Requesting Special requirement:HDI Buried vias and blind vias, one step stack up /impedance control/high TG

 

 

FAQ:
Q1:Could you provide PCB Assembly services and components sourcing?
A: Yes, we could also provide components sourcing and PCB Assembly services as well as box build if request.

 

Q2:Which countries have you worked with?
A:USA, Canada, Italy, Germany, UK, Spain, France, Russia, Iran, Turkey, Czech Republic,Austria, Australia, Brazil, Japan, India etc.

 

Q3:Will our PCB files be checked.
A: Yes. Your data will be checked by our Engineers Team. If we find any technical issues or have any inquires, we will contact you and solve the problems together.

 

Q4: Does our product will be tested before shipment.
A: Yes. We could provide Function Circuit Testing if you provide us the testing methods.

 

Q5:Which payment method do you accept?
A: Wire Transfer(T/T), Letter of Credit(L/C), or Paypal( Paypal is only for small value less than 500usd)

Product Tags: 4mil High Density Interconnect PCB   TG170 High Density Interconnect PCB   TG170 PCB Board Fabrication  
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