Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface
Quality
Product Description:
Sapphire Wafer is a high-performance sapphire plate manufactured
with a high-grade sapphire substrate. It has an orientation of
±0.5°, a wafer shape, a clear aperture of greater than 90%, and TTV
of ≤3μm. It is also customizable in size to meet the needs of
customers. This high-quality sapphire plate is perfect for use in a
variety of applications, such as electronics, optics, and
aerospace. It can withstand high temperatures, is
scratch-resistant, and is extremely durable. With its unique
properties, Sapphire Wafer is an ideal choice for any application
requiring a reliable and cost-effective sapphire plate.
Technical Parameters:
| Sapphire Wafer |
| Item | 2 Inch | 4 Inch | 6 Inch |
| Crystal | LED Grade Sapphire | LED Grade Sapphire | LED Grade Sapphire |
| Purity | >99.998% | >99.998% | >99.998% |
| Color | Transparent | Transparent | Transparent |
| Orientation | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° |
| Diameter | 50.8±0.1mm | 100±0.2mm | 150±0.2mm |
| Thickness | 430±15um | 650±25um | 1300±25um |
| PF Location | A-axist±0.2° | A-axist±0.2° | A-axist±0.2° |
| Flat Length | 16.0±1.0mm | 30.0±1.0mm | 49.0±1.0mm |
| Front Side Surface | Mirror polished EPI-Ready | Mirror polished EPI-Ready | Mirror polished EPI-Ready |
| Surface Roughness | Ra<3A | Ra<3A | Ra<3A |
| Back Side Roughness | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um |
| TTV | <5.0um | <10um | <15um |
| BOW | 0~-5um | 0~-10um | 0~-30um |
| Warp | <10um | <15um | <40um |
| Bubble& Color | None by visual inspection in fluorescent light |
| Cleanliness | Free visible contamination |
| Packaging | Vacuum packed in one-piece box or Entegris cassettes of 25 |
Applications:
BonTek's SAP series sapphire wafers are world-renowned for their
high-end quality and reliable performance, making them ideal for a
wide variety of applications. With a model number of SAP, the
sapphire wafer is certified with ISO:9001, and has a minimum order
quantity of 10 pcs, with a price of $60.00/ea. The wafer comes in a
cassette, vacuum sealed for optimal performance, with a delivery
time of 2~4 weeks. Payment terms are TT/in advance, and supply
ability is 10000 pcs. The parallelism of the wafer is ≤3 Arc Sec,
with bow & warp of ≤20μm. The thickness of the sapphire plate
varies from 0.5mm-3mm, with excellent edge grinding and roundness,
with an orientation of ±0.5°. BonTek's SAP series of sapphire
wafers are perfect for use in aerospace, electronic, optical, and
medical industries, providing users with an unparalleled level of
performance.
Customization:
Customized Sapphire Wafer by BonTek
Brand Name: BonTek
Model Number: SAP
Place of Origin: China
Certification: ISO:9001
Minimum Order Quantity: 10 pcs
Price: $60.00/ea
Packaging Details: Cassette, vacuum sealed
Delivery Time: 2~4 weeks
Payment Terms: TT/in advance
Supply Ability: 10000 pcs
Material: Sapphire
TTV: ≤3μm
Orientation: ±0.5°
Surface Roughness: Ra<0.2nm
Thickness: 0.5mm-3mm
BonTek provides customized Sapphire Wafer with ISO:9001
Certification. Our Sapphire Slice is made from superior quality
material with TTV≤3μm, Orientation ±0.5°, and Surface Roughness
Ra<0.2nm. The thickness of Sapphire Slice ranges from 0.5mm to
3mm. Our minimum order quantity is 10 pcs and the price is
$60.00/ea. We also offer vacuum sealed cassette packaging and
delivery time is 2~4 weeks. Payment terms is TT/in advance and we
can supply 10000 pcs at maximum.
Packing and Shipping:
Sapphire Wafer Packaging and Shipping:
Sapphire wafers are packaged and shipped in a secure container with
anti-static foam. The package is sealed to prevent contamination
and ensure the wafers are not damaged during transit. We use a
courier service to ensure the product reaches its destination
quickly and safely. All shipments are tracked to ensure delivery.
