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Hangzhou Freqcontrol Electronic Technology Ltd.
Hangzhou Freqcontrol Electronic Technology Ltd. We Grow Crystal. We Fabricate Wafer. We are Piezoelectric Specialist.
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High Resistance Sapphire Polished Wafer 3 Inch C Plane Optical Crystal

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Hangzhou Freqcontrol Electronic Technology Ltd.

City: hangzhou

Province/State:shanghai

Country/Region:china

Tel:86-571-85803723

Contact Person:
Mr.Xu
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High Resistance Sapphire Polished Wafer 3 Inch C Plane Optical Crystal

Brand Name BonTek
Model Number Sapphire (Al2O3)
Certification ISO:9001
Place of Origin China
Minimum Order Quantity 5 Pieces
Price Negotiable
Payment Terms T/T
Supply Ability 10000 pieces/Month
Delivery Time 1-4 weeks
Packaging Details Cassette, Jar, Film package
Material Sapphire Wafer
Growth Method Kyropoulos method
Melting Point 2040 °C
Thermal Conductivity 27.21 W/(m x K) at 300 K
CTE 5.6 x 10 -6 /K (parallel C-axis) & 5.0 (perpendicular C-axis) x 10 -6 /K
Hardness Knoop 2000 kg/mm 2 with 2000g indenter
Specific Heat Capacity 419 J/(kg x K)
Dielectric Const. 11.5 (parallel C-axis) 9.4 (perpendicular C-axis) at 1MHz
Detailed Product Description

High Resistance Sapphire Polished Wafer 3 Inch C-Plane Optical Crystal

 

Sapphire is a single crystal of alumina and is the second-hardest material in nature, after diamond. Sapphire has good light transmittance, high strength, collision resistance, wear resistance, corrosion resistance and high temperature and high pressure resistance, biocompatibility, is an ideal substrate material for the production of semiconductor optoelectronic devices, the electrical properties of sapphire make it become the substrate material for the production of white and blue LED.

 

 

Item

3-inch C-plane(0001) 500μm Sapphire Wafers

Crystal Materials

99,999%, High Purity, Monocrystalline Al2O3

Grade

Prime, Epi-Ready

Surface Orientation

C-plane(0001)

C-plane off-angle toward M-axis 0.2 +/- 0.1°

Diameter

76.2 mm +/- 0.1 mm

Thickness

500 μm +/- 25 μm

Primary Flat Orientation

A-plane(11-20) +/- 0.2°

Primary Flat Length

22.0 mm +/- 1.0 mm

Single Side Polished

Front Surface

Epi-polished, Ra < 0.2 nm (by AFM)

(SSP)

Back Surface

Fine ground, Ra = 0.8 μm to 1.2 μm

Double Side Polished

Front Surface

Epi-polished, Ra < 0.2 nm (by AFM)

(DSP)

Back Surface

Epi-polished, Ra < 0.2 nm (by AFM)

TTV

< 15 μm

BOW

< 15 μm

WARP

< 15 μm

Cleaning / Packaging

Class 100 cleanroom cleaning and vacuum packaging,

25 pieces in one cassette packaging or single piece packaging.

 

Item

4-inch C-plane(0001) 650μm Sapphire Wafers

Crystal Materials

99,999%, High Purity, Monocrystalline Al2O3

Grade

Prime, Epi-Ready

Surface Orientation

C-plane(0001)

C-plane off-angle toward M-axis 0.2 +/- 0.1°

Diameter

100.0 mm +/- 0.1 mm

Thickness

650 μm +/- 25 μm

Primary Flat Orientation

A-plane(11-20) +/- 0.2°

Primary Flat Length

30.0 mm +/- 1.0 mm

Single Side Polished

Front Surface

Epi-polished, Ra < 0.2 nm (by AFM)

(SSP)

Back Surface

Fine ground, Ra = 0.8 μm to 1.2 μm

Double Side Polished

Front Surface

Epi-polished, Ra < 0.2 nm (by AFM)

(DSP)

Back Surface

Epi-polished, Ra < 0.2 nm (by AFM)

TTV

< 20 μm

BOW

< 20 μm

WARP

< 20 μm

Cleaning / Packaging

Class 100 cleanroom cleaning and vacuum packaging,

25 pieces in one cassette packaging or single piece packaging.

 

Item

6-inch C-plane(0001) 1300μm Sapphire Wafers

Crystal Materials

99,999%, High Purity, Monocrystalline Al2O3

Grade

Prime, Epi-Ready

Surface Orientation

C-plane(0001)

C-plane off-angle toward M-axis 0.2 +/- 0.1°

Diameter

150.0 mm +/- 0.2 mm

Thickness

1300 μm +/- 25 μm

Primary Flat Orientation

A-plane(11-20) +/- 0.2°

Primary Flat Length

47.0 mm +/- 1.0 mm

Single Side Polished

Front Surface

Epi-polished, Ra < 0.2 nm (by AFM)

(SSP)

Back Surface

Fine ground, Ra = 0.8 μm to 1.2 μm

Double Side Polished

Front Surface

Epi-polished, Ra < 0.2 nm (by AFM)

(DSP)

Back Surface

Epi-polished, Ra < 0.2 nm (by AFM)

TTV

< 25 μm

BOW

< 25 μm

WARP

< 25 μm

Cleaning / Packaging

Class 100 cleanroom cleaning and vacuum packaging,

25 pieces in one cassette packaging or single piece packaging.

 

 

Acceptance Check

 

1. The product is fragile. We have adequately packed it and labeled it fragile. We deliver through excellent domestic and international express companies to ensure transportation quality.

 

2. After receiving the goods, please handle with care and check whether the outer carton is in good condition. Carefully open the outer carton and check whether the packing boxes are in alignment. Take a picture before you take them out.

 

3. Please open the vacuum package in a clean room when the products are to be applied.

 

4. If the products are found damaged during courier, please take a picture or record a video immediately. DO NOT take the damaged products out of the packaging box! Contact us immediately and we will solve the problem well.

Product Tags: Sapphire Polished Wafer 3 Inch   High Resistance Sapphire Polished Wafer   C Plane Optical Crystal Sapphire Wafer  
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