Amplifier IC Chips Texas Instruments/TI LMV842MM/NOPB ECAD Module | PCB Symbol,Footprint & 3D Model | Supply and Demand Status | Balance | Popularity | High | Fake Threat In the Open Market | 82 pct. | Quantity per package | 1000 | HTSUS | 8542.33.0001 | ECCN | EAR99 | REACH Status | REACH Unaffected | MSL Level | 1 (Unlimited) | Case / Package | 8-VSSOP | Family Name | LMV842 | Mounting | Surface Mount | Operating Temperature Range | -40°C ~ 125°C | Package | Reel - TR | Other Part Number | LMV842MMTR-ND, LMV842MM/NOPBCT, LMV842MMDKR-ND, LMV842MMNOPB,
-LMV842MM-NDR, LMV842MMCT, LMV842MMCT-ND, LMV842MMDKR, LMV842MMTR,
*LMV842MM/NOPB, LMV842MM/NOPBTR, LMV842MM/NOPBDKR | Manufacturer | Texas Instruments | Win Source Part Number | 923518-LMV842MM/NOPB | Estimated Pruduction Lead Time | 34 Weeks | Categories | Integrated Circuits (ICs) | Package | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Series | Automotive, AEC-Q100, LMV® | Features | General Purpose Amplifier Circuit Rail-to-Rail 8-VSSOP |
- Unless Otherwise Noted, Typical Values at
TA = 25 °C, V+ = 5 V. - Small 5-Pin SC70 Package (2.00 mm × 1.25 mm × 0.95 mm)
- Wide Supply Voltage Range: 2.7 V to 12 V
- Specified Performance at 3.3 V, 5 V and ±5 V
- Low Supply Current: 1 mA Per Channel
- Unity Gain Bandwidth: 4.5 MHz
- Open-Loop Gain: 133 dB
- Input Offset Voltage: 500 µV Maximum
- Input Bias Current: 0.3 pA
- CMRR at 112 dB and PSSR at 108 dB
- Input Voltage Noise: 20 nV/√Hz
- Temperature Range: −40°C to 125°C
- Rail-to-Rail Input and Output (RRIO)
The LMV84x devicesare low-voltage and low-power operational
amplifiers that operate with supply voltages ranging from2.7 V to
12 V and have rail-to-rail input and output capability. Their low
offset voltage, lowsupply current, and CMOS inputs make them ideal
for high impedance sensor interface andbattery-powered
applications. The single LMV841 isoffered in the space-saving 5-pin SC70 package,
the dual LMV842 in the 8-pin VSSOP and 8-pin SOIC packages, and the
quadLMV844 in the 14-pin TSSOP and14-pin SOIC packages. These small
packages are ideal solutions for area-constrained PCBs andportable
electronics.
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