TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001
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Amplifier IC Chips Texas Instruments/TI TLV314QDBVRQ1
Features for the TLV314-Q1
Description for the TLV314-Q1The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiersrepresents a new generation of low-power, general-purpose operational amplifiers. Rail-to-railinput and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a widebandwidth of 3 MHz to make this family very attractive for a variety of battery-poweredapplications that require a good balance between cost and performance. The TLVx314-Q1 familyachieves a low-input bias current of 1 pA, making it an excellent choice for high impedancesensors. The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer:unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejectionfilter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD)protection (4-kV HBM). These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to+125°C. The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. TheTLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 isoffered in a 14-pin TSSOP package. |
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Product Tags: TI Amplifier IC Chips TDA2030 Amplifier IC Chips TLV314QDBVRQ1 |
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