Molybdenum and Copper For Use In Electronic Packaging Materials,
Use Copper Alloy Sheet.
1. A Description Of Copper Alloy Sheet With Molybdenum For Use In
Electronic Packaging Materials
Copper molybdenum copper sheet, also known as CMC material, is a
metal-based plane layered composite electronic packaging material.
Its core is made of pure molybdenum, and its exterior is either
coated in pure copper or copper that has undergone dispersion
strengthening. Because the middle of the copper molybdenum copper
sheet is a molybdenum plate, and molybdenum has excellent strength,
electrical conductivity, and thermal conductivity, so this type of
material has good thermal conductivity and low expansion
coefficient in the plane direction, and basically does not There
are densification issues. The production process generally adopts
rolling composite, electroplating composite, explosion forming and
other methods to process and prepare. Compared with
particle-enhanced electronic packaging materials produced by powder
metallurgy methods such as Mo/Cu and W/Cu, the rolling composite
method has high efficiency and low production cost in producing
flat composite electronic packaging materials, and can produce
large-sized packaging materials. Therefore, the flat composite
electronic packaging material of copper-molybdenum-copper sheet is
very beneficial to the production of the electronic industry, and
it is easy to produce "scale benefits".
The thermal expansion coefficient of this material is adjustable,
the thermal conductivity is high, and the high temperature
resistance performance is excellent. The production process is
generally prepared by rolling composite, electroplating composite,
explosion forming and other methods. Mainly used as heat sinks,
lead frames, and bottom expansion and thermal conduction paths for
multi-layer printed circuit boards (PCBs).
2.Parameter of Copper Molybdenum Copper Alloy Sheet For Electronic Packaging
Materials:
| Type | Material | Density
(g/cm³) | Thermal Conductivity
W/mK | Thermal expansion coefficient
10-6/K |
| Copper Molybdenum Copper Alloy Sheet | 1:1:1
Cu/Mo/Cu | 9.32 | 305(xy)/250(z) | 8.8 |
1:2:1
Cu/Mo/Cu | 9.54 | 260(xy)/210(z) | 7.8 |
1:3:1
Cu/Mo/Cu | 9.66 | 244(xy)/190(z) | 6.8 |
1:4:1
Cu/Mo/Cu | 9.75 | 220(xy)/180(z) | 6 |
1:5:1
Cu/Mo/Cu | 9.74 | 200(xy)170(z) | 6.26 |
1:7:1
Cu/Mo70/Cu | 9.46 | 310(xy)180(z) | 7.2 |
13:74:13
Cu/Mo/Cu | 9.88 | 200(xy)/170(z) | 5.6 |
3. Feature of Copper Molybdenum Copper Alloy Sheet For Electronic Packaging
Materials:
1). Copper Molybdenum Copper Alloy Sheet is a composite material
with a sandwich-like structure, the core material is molybdenum,
and both sides are coated with copper. Its coefficient of expansion
and thermal conductivity are designed for use in heat sinks, lead
frames, low-expansion layers and thermal vias in multilayer printed
circuit boards (PCBs). This material can be stamped.
2). Power electronics and circuits operate with considerable heat
production.The heat sink material helps to dissipate heat from the
chip, transfer it to other media, and maintain stable operation of
the chip.
3). It has a thermal expansion coefficient and high thermal
conductivity matching with different substrates; excellent high
temperature stability and uniformity; excellent processing
performance;
4. Application of Copper Molybdenum Copper Alloy Sheet For Electronic Packaging
Materials:
1). Product use is similar to tungsten copper alloy.
2). Its expansion coefficient and thermal conductivity can be
designed for RF, microwave and semiconductor high-power devices.
Copper Molybdenum Copper Alloy Sheet electronic packaging material
has excellent thermal conductivity and adjustable thermal expansion
coefficient. It is currently the preferred electronic packaging
material for high-power electronic components at home and abroad,
and can be matched with Be0 and Al203 ceramics. It is widely used
in microwave, communication, radio frequency, aviation Aerospace,
power electronics, high-power semiconductor lasers, medical and
other industries. For example, the BGA package that is popular in
the world now uses a large number of copper-molybdenum-copper
sheets as the substrate. In addition, in the fields of microwave
packaging and radio frequency packaging, this material is also
widely used as heat sink. In military electronic equipment,
copper-molybdenum-copper sheet is often used as the base material
for high-reliability circuit boards.
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