Turnkey PCB Assembly Carbon Ink Rogers Consumer Electronics
Multi-Layer Turnkey PCB Assembly Description: 1. Quick-turn and flexible delivery
2. Support a wide range of PCBs: high-layer, multi-layer,
rigid-flex, high frequency, high speed, etc.
3. Professional supplier positioning.
4. Seamless link from prototype to mass production.
5. Whole-flow quality assurance, IPC, Special industry inspection
standard. Turnkey PCB Assembly Parameters: Item | Technical Parameter | Layer | 2-64 | Thickness | 0.3-6.5mm | Copper Thickness | 0.3-12 oz | Min Mechanical Hole | 0.1mm | Min Laser Hole | 0.075mm | HDI | 1+n+1,2+n+2,3+n+3 | Max Aspect Ratio | 20:01 | Max Board Size | 650mm*1130mm | Min Width/Space | 2.4/2.4mil | Min Outline Tolerance | ±0.1mm | Impedance Tolerance | ±5% | Min PP Thickness | 0.06mm | Bow &Twist | ≤0.5% | Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 | Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP | Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Turnkey PCB Assembly Introduction: 1. designability
Requirements for various properties of PCB (electrical, physical,
chemical, mechanical, etc.) can be achieved through design
standardization, normalization, etc. In this way, the design time
is short and the efficiency is high.
2. producibility
PCB adopts modern management, which can realize standardization,
scale (quantization), and automatic production, so as to ensure the
consistency of product quality. |
