One-Stop Turnkey PCB Assembly Immersion Gold + OSP High-Layer
Carbon Ink Turnkey PCB Assembly Description: 1. A team of experts with more than 10 years of experience.
2. Professional component certified engineers and experienced
supply chain management team.
3. Pay attention to the latest international market information and
provide competitive prices.
4. Certified suppliers and parts. Turnkey PCB Assembly Parameters: Item | Technical Parameter | Layer | 2-64 | Thickness | 0.3-6.5mm | Copper Thickness | 0.3-12 oz | Min Mechanical Hole | 0.1mm | Min Laser Hole | 0.075mm | HDI | 1+n+1,2+n+2,3+n+3 | Max Aspect Ratio | 20:01 | Max Board Size | 650mm*1130mm | Min Width/Space | 2.4/2.4mil | Min Outline Tolerance | ±0.1mm | Impedance Tolerance | ±5% | Min PP Thickness | 0.06mm | Bow &Twist | ≤0.5% | Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 | Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP | Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Turnkey PCB Assembly Introduction: 1. designability
Requirements for various properties of PCB (electrical, physical,
chemical, mechanical, etc.) can be achieved through design
standardization, normalization, etc. In this way, the design time
is short and the efficiency is high.
2. producibility
PCB adopts modern management, which can realize standardization,
scale (quantization), and automatic production, so as to ensure the
consistency of product quality. |
