Carbon Ink Printed Circuit Board Fabrication Conformal Coating
Embedded Resistor
Printed Circuit Board Fabrication Description:
PCB products not only facilitate the standardized assembly of
various components but also enable automated and large-scale mass
production. In addition, the overall assembly of the PCB and
various other components can also form larger components, systems,
and even complete machines.
Since the components of PCB products and various components are
assembled in a standardized design and large-scale production,
these components are also standardized. Therefore, once the system
fails, it can be replaced quickly, conveniently, and flexibly, and
the work of the system can be quickly restored.
Printed Circuit Board Fabrication Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Printed Circuit Board Fabrication Introduction:
1. Provide mechanical support for fixing and assembling various
electronic components such as integrated circuits, realize wiring
and electrical connection or electrical insulation between various
electronic components such as integrated circuits, and provide
required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide
identification characters and graphics for component insertion,
inspection, and maintenance.
3. After the electronic equipment adopts printed boards, due to the
consistency of similar printed boards, manual wiring errors are
avoided, and automatic insertion or mounting of electronic
components, automatic soldering, and automatic detection can be
realized, which ensures electronic products. quality, improve labor
productivity, reduce costs, and facilitate maintenance.
4. Provide the required electrical characteristics, characteristic
impedance, and electromagnetic compatibility characteristics for
the circuit in high-speed or high-frequency circuits.
