Gold Finger Plating Printed Circuit Board Fabrication Through Hole
Assembly
Printed Circuit Board Fabrication Description:
1. Assemblability
PCB products not only facilitate the standardized assembly of
various components but also enable automated and large-scale mass
production. In addition, the overall assembly of the PCB and
various other components can also form larger components, systems,
and even complete machines.
2. Maintainability
Since the components of PCB products and various components are
assembled in a standardized design and large-scale production,
these components are also standardized. Therefore, once the system
fails, it can be replaced quickly, conveniently, and flexibly, and
the work of the system can be quickly restored.
Printed Circuit Board Fabrication Parameters:
| SMT Capability | 14 million spots per day |
| SMT Lines | 12 SMT lines |
| Reject Rate | R&C: 0.3% |
| IC: 0% |
| PCB Board | POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base
boards |
| Parts Dimension | Min BGA Footprint:03015 Chip/0.35mm BGA |
| Parts SMT Accuracy:±0.04mm |
| IC SMT Accuracy:±0.03mm |
| PCB Dimension | Size:50*50mm-686*508mm |
| Thickness: 0.3-6.5mm |
Printed Circuit Board Fabrication Introduction:
1. Provide mechanical support for fixing and assembling various
electronic components such as integrated circuits, realize wiring
and electrical connection or electrical insulation between various
electronic components such as integrated circuits, and provide
required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide
identification characters and graphics for component insertion,
inspection, and maintenance.
3. After the electronic equipment adopts printed boards, due to the
consistency of similar printed boards, manual wiring errors are
avoided, and automatic insertion or mounting of electronic
components, automatic soldering, and automatic detection can be
realized, which ensures electronic products. quality, improve labor
productivity, reduce costs, and facilitate maintenance.
4. Provide the required electrical characteristics, characteristic
impedance and electromagnetic compatibility characteristics for the
circuit in high-speed or high-frequency circuits.
