2 - 68 Layers Printed Circuit Board Fabrication Rigid - Flex Joint
Board Back Drill
Printed Circuit Board Fabrication Description:
1. A team of experts with more than 10 years of experience.
2. Professional component certified engineers and experienced
supply chain management team.
3. Pay attention to the latest international market information and
provide competitive prices.
4. Certified suppliers and parts.
Printed Circuit Board Fabrication Parameters:
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Printed Circuit Board Fabrication Introduction:
1. High reliability
Through a series of technical means such as inspection, testing,
and aging tests, the PCB can be guaranteed to work reliably for a
long time (usually 20 years).
2. designability
Requirements for various properties of PCB (electrical, physical,
chemical, mechanical, etc.) can be achieved through design
standardization, normalization, etc. In this way, the design time
is short and the efficiency is high.
