4131 - 4140 of 4142
bga package memory chips
Selling leads
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... chip. Specification Of FF3MR12KM1HOSA1 Part Number: FF3MR12KM1HOSA1 Rds On (Max) @ Id, Vgs: 2.13mOhm @ 500A, 15V Input Capacitance (Ciss) (Max) @ ...
2025-07-20 00:22:40
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... Part Number: XC7K160T-2FBG484I RAM: 2188 Kbit Unit Weight: 196.750 G Tradename: Kintex Logic Cells: 478K Package Options: Bare-Die Flip-Chip And ...
2024-12-09 22:08:35
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...their region. A region is defined as an area that is 50 I/O and 50 CLB high and half the chip wide. Specification Of XC7K410T-1FFG900I Part Number: ...
2024-12-09 22:21:11
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...emerging connectivity interfaces MIPI, PCIe, and GbE, for example by matching advanced, small-footprint packaging with on-chip resources. ...
2024-12-09 22:21:11
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... Product Description Of NRF52833-CJAA-R NRF52833-CJAA-R is a single-chip wireless solution offering built-in USB and advanced wireless connectivity ...
2025-06-22 00:16:26
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... Built around ESP32S2 series of SoC, Xtensa® singlecore 32bit LX7 microprocessor, Flash up to 16 MB, optional 2 MB PSRAM in chip package. ...
2024-12-09 22:24:04
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... ESP32-S2-SOLO-U-N4 is 2.4 GHz WiFi (802.11 b/g/n) module, Flash up to 16 MB, optional 2 MB PSRAM in chip package. Specification Of ESP32-S2-SOLO-U...
2025-07-02 00:18:49
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... MSI-X Yes NT Ports 8 Packaging Size 47.5mm x 47.5mm Ports 72 Power Typ. 49 Features Of PEX89144B0 On-chip best-in-class Broadcom32-GT/s SerDes ...
2025-07-02 00:18:48
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... Series Switch Chips. PEX9765-B080BCG: Managed PCI Express Switches Based on ExpressFabric® Technology. Specification Of PEX9765-B080BCG Part ...
2025-07-14 00:20:12
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... × 27 mm2). PEX9749-AA80BIG is PEX9700 Series Switch Chips - Managed PCI Express Switches Based on ExpressFabric® Technology. Specification Of ...
2025-07-14 00:20:12
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