4091 - 4100 of 4142
bga package memory chips
Selling leads
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...Chip ESP8684H1 RF Transceiver ICs 24-QFN Low Power Product Description Of ESP8684H1 ESP8684H1 is a single-core RISC-V microcontroller with 2.4 ...
2025-06-22 00:16:26
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... Chip, the package is 2577-BBGA, FCBGA(Surface Mount). Specification Of XCVU13P-L2FSGA2577E Part Number XCVU13P-L2FSGA2577E Number of I/O 448 ...
2025-07-20 00:22:47
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...Chip, package is 48-VFQFN, Surface Mount. Specification Of XMC4100-Q48K128 BA Part Number: XMC4100-Q48K128 BA Number Of I/O: 21 Speed: 80MHz ...
2025-07-20 00:22:56
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... Switching Characteristics, the package is FCBGA-485. Specification Of XC7Z030-L2SBG485I Part Number: XC7Z030-L2SBG485I Mounting Style: SMD/SMT ...
2024-12-09 22:01:59
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...Chips - 33-Lane, 9-Port PCI Express Gen3 ExpressFabric Device, Package Size is 27mm × 27mm. Specification Of PEX9733-AA80BCG Part Number: PEX9733...
2025-07-02 00:18:48
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...Chips, 16-Lane, 5-Port ExpressFabric Switch, Package Size is 19mm × 19mm. Specification Of PEX9716-AA80BCG Part Number PEX9716-AA80BCG DPC /eDPC ...
2025-07-02 00:18:48
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...(Surface Mount). CY8C6116BZI-F54 Up to 64 Programmable GPIOs, Quad-SPI (QSPI)/Serial Memory Interface (SMIF), Security Built into Platform ...
2024-12-09 21:35:22
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..., ultra-low-power Microcontroller IC, package is 68-QFN (8x8), Surface Mount. CY8C6145LQI-S3F42 Backup domain with 64 bytes of memory and real-time ...
2025-07-20 00:22:50
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... rates up to 100 MHz and Data rates up to 200 MB/sec. Specification Of MIMX8MN3CVTIZAA Part Number: MIMX8MN3CVTIZAA L1 Cache Data Memory: 2 X 32 KB ...
2025-07-20 00:23:16
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... lower speed,higher voltage range I/O standards.Arranged in banks of 22,the number of HDIO varies depending on Versal device and package. ...
2024-12-09 21:37:54
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