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bga package integrated circuit chip
Selling leads
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2 Core 64-Bit LS1028ASE7HNA Microprocessors - MPU Industrial Applications Processors Product Description Of LS1028ASE7HNA LS1028ASE7HNA integrates the ...
2025-05-30 09:34:25
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...®-A53, the package is 425-FCCSP (13x13), Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4 GHz. Specification Of AM6254ATCGGAA...
2024-12-09 21:35:22
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..., the package is 176-LQFP (24mm x 24mm), Surface Mount. Specification Of STM32F427IGT6 Part Number: STM32F427IGT6 Program Memory Size: 1MB (1M X 8) ...
2025-07-20 00:23:10
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...Chip ESP8684H1 RF Transceiver ICs 24-QFN Low Power Product Description Of ESP8684H1 ESP8684H1 is a single-core RISC-V microcontroller with 2.4 ...
2025-06-22 00:16:26
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... high accuracy measurements with very low power consumption, in an ultra-compact WLCSP (Wafer Level Chip Scale Package). HDC2010YPAR provides high ...
2025-06-22 00:16:25
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...QSGMII/SGMII MAC. It includes an integrated quad port two-wire serial multiplexer (MUX) to control SFPs or PoE modules. Specification Of VSC8504XKS...
2025-07-20 00:22:40
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...Direction Output SIP-2 Product Description Of ARS19510LUBBTN ARS19510LUBBTN integrates an advanced Hall-effect circuit IC and EMC protection ...
2024-12-10 00:28:25
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