BCM56873A0KFSBG Ethernet IC 2.0Tb/s Trident3-X7 Programmable Multi-layer Switch

BCM56873A0KFSBG Ethernet IC Ethernet Switch 2.0Tb/s Trident3-X7 Programmable Multi-layer Switch​

Product Description Of BCM56873A0KFSBG

BCM56873A0KFSBG is 2.0Tb/s Trident3-X7 Programmable Multi-layer Switch. BCM56873A0KFSBG can be interconnected via the HiGig2™ protocol to support multi-terabit chassis designs for large-scale data center, enterprise and service provider applications. The StrataXGS Trident 3 switch with integrated FleXGS™ Programmability technology has been designed to address performance, capacity and service requirements for next-generation data centers and cloud computing applications.

Specification Of BCM56873A0KFSBG

Part Number: BCM56873A0KFSBG
Series: Trident3-X7
Package: BGA
Bandwidth: 2.0Tb/s
Sample I/O Configurations: 20x100GbE
Type: L3 Programmable Ethernet Switch

Features Of BCM56873A0KFSBG

Fully programmable dataplane allows introduction of new features via in-field upgrade
Support for new overlays and tunneling such as GENEVE, NSH, VXLAN, GPE, MPLS, MPLS over GRE/UDP, GUE, ILA and PPPoE
Up to 128x 25G integrated SerDes with CL 74, CL 91 and CL 108 FEC
New instrumentation features such as timestamping, trace captures and Inband Telemetry
32MB of on-chip fully shared packet buffer
Dynamic Load Balancing enhances ECMP
Large, programmable on-chip forwarding databases for L2 switching, L3 routing, label switching, and overlay forwarding
3X increased ACL scale to support evolving policy/security requirements
PCIe Gen3 x4 host CPU interface with on-chip accelerators improves control-plane update and boot performance by up to 5X
Programmable support for enhanced network telemetry, including per-packet timestamping, Flow Tracker, microburst detection, latency/drop monitor, Active probe-based in-band network telemetry, and in-band OAM processing; integrated with open-source BroadView v2 telemetry agent and analytics software
Adaptive Routing for dynamic traffic engineering in non-Clos topologies
Full feature compatibility with previous generation Trident 2 and Trident 2+ devices

Applications Of BCM56873A0KFSBG
Single-chip solution for data center Top-of-Rack, Aggregation and Spine Switches
Data center Fixed and Chassis/Modular switches
Enterprise aggregation and converged core
Data Center Interconnect (DCI)
Software-Defined Networking Solutions

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FAQ
Q. Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q:Which Certificates do you have?
A:We are ISO 9001:2015 Certified Company and member of ERAI.
Q:Can you support small quantity order or sample?Is the sample free?
A:Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q:How to ship my order? Is it safe?
A:We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q:What about the lead time?
A:We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.