XCVU13P-3FHGC2104E Integrated Circuit Chip 2104FCBGA Field Programmable Gate Array

XCVU13P-3FHGC2104E Integrated Circuit Chip 2104FCBGA Field Programmable Gate Array​

Product Description Of XCVU13P-3FHGC2104E

XCVU13P-3FHGC2104E For the HP I/O banks with a VCCO of 1.8V and separated VCCO and VCCAUX_IO power supplies, the IL maximum current is 70 µA.

Specification Of XCVU13P-3FHGC2104E

Features Of Integrated Circuit Chip

• VRP resistor tolerance is (240Ω ±1%).
• If VRP resides at a different bank (DCI cascade), the range increases to ±15%.
• For UI smaller than 20 µs.
• For the -1M devices, the temperature limits are –55°C to 125°C.
• Only the SUB_LVDS receiver is supported in HD I/O banks.

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A: We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.