Sliver Tin Alloy Solder Customized AgSn Alloy Preforms

Gold Tin Alloy Solder Customized AuSn Alloy Preforms

Product Description

80Au/20Sn has a melting point of 280°C (556°F) and can be made into solder preforms to address various options for specific applications. Gold-tin solder preforms are typically used where high melting points (over 150°C), good thermal fatigue properties and high strength properties at elevated temperatures are required. It is also used for properties that require high tensile strength and high corrosion resistance without melting during the subsequent low temperature reflow process. The alloy is also suitable for fluxless soldering. Based on these, gold-tin solder preforms are the best choice for die attach, especially on some high-power devices.

Gold-tin alloy is a binary alloy of gold and tin, with a eutectic temperature of 278°C and a concentration of 30% Sn. Alloys such as AuSn20, AuSn27 and AuSn90 have high thermal conductivity, low vapor pressure, excellent corrosion resistance, good wettability and fluidity. It is manufactured by the "hot composite-cold rolling" process, which can roll foils of 0.05 to 0.1 mm. Gold-tin alloys are used for brazing of gold-plated or gold-plated alloy lead frames and leads. Adding (50-300) × 10-6 platinum and/or palladium new brazing filler metal to AuSn20 alloy has the effect of inhibiting the excessive diffusion and random flow of the brazing filler metal and improving the brazing effect.

Material Features

1. High temperature strength, high melting point solder;

2. Corrosion resistance;

3. Compatible with other precious metals.

Size selection

The preform size can refer to the chip size. Usually the dimensions X and Y of the preform are 90-100% of the chip size. Regarding thickness, thinner bond lines are desirable without sacrificing reliability. The most important thing for die attach applications is the flatness of the solder preforms. Due to the limitations of the process and fixture, it is difficult to completely fix the chip. The chip can be allowed to float freely on the preform by a small amount. If the preform is not flat, it will tilt the chip during reflow and fail the soldering, so keeping the preform flat is key.

Product display

Packaging and Shipping

Packing Details : Carton and wooden box packaging

Delivery Details : 5-10 days(Negotiated and decided on a case-by-case basis)

FAQ

1.Are you trading or manufacturer ?
We are company,and we have our own factory

2.How long is your delivery time?

3.Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
If you have another question, pls feel free to contact us

Our advantage
1. Perfect management system: We operate strictly in accordance with the quality management system.
2. Professional sales and after-sales service team: We have a number of sales specialists, 24 hours a day online service, can quickly solve customer questions and after-sales.
3. Reliable quality: from the procurement of raw materials, to the process inspection of product production and finished product inspection, to the inspection of packaging, all are strictly controlled, with a number of advanced testing equipment and instruments, such as temperature rise tester, conductivity tester , tensile testing machine, etc.
4. Timely delivery: We have many years of production experience, strictly control the cost of each process, have multiple automated production equipment, and have a stable production chain.
5. Intelligent workshop: It has intelligent mechanical operators and multiple precision operation platforms.