Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
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Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation
Description:
silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting and encapsulating compounds provide reliable long term performance for microelectronic, electronic, electrical devices.
Features:
Specification:
The above performance data is typical data measured in a laboratory
environment with a temperature of 25°C and a humidity of 70%. It is for
customer reference only FAQ:
Q1: Are you trading company or manufacturer ? A: We are factory. Q2: How long is your delivery time? A: It is 5-10 days if the goods are in stock. or it is 15-20 days
if the goods are not instock, it is according to quantity. A: T/T,L/C. A: If our present samples are ok for you. Samples are free,only
need to to pay for the freight. If you want to see a sample with
your logo,some sample fees will be needed. A: Yes, We are capable in developing products according to your requirements. Packaging: We offer different size of packaging, 5kg buckets and 20kg buckets
are normal size. Customized Company Display: |
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| Product Tags: Epoxy AB Potting Glue Potting Glue Electronic Components Encapsulation Epoxy Potting Compound |
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