Electronic Components Potting Glue Surface Encapsulation Light Yellow
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Epoxy Resin AB Glue Potting Glue For Electronic Components Surface Encapsulation
Description:
silicones systems. Our products feature outstanding electrical
insulation properties, superior adhesive strength, thermal
conductivity and excellent chemical resistance. Potting and
encapsulating compounds provide reliable long term performance for
microelectronic, electronic, electrical devices, components
including: Switches Ignition coils Electronic modules Motors Connectors Sensors Cable harness assemblies Capacitors Transformers Rectifiers Specification:
The above performance data is typical data measured in a laboratory
environment with a temperature of 25°C and a humidity of 70%. It is for
customer reference only FAQ:
Q: Can you offer samples? A: Yes, we offer samples as you requested. Q: How about the MOQ ? A: No MOQ for the standard product. Q: What's the MOQ ? Q: How about the lead time? A: In General, the lead time will be 2 weeks for normal order quantity. For mass order, it is negotiable. Packaging: We offer different size of packaging, 5kg buckets and 20kg buckets
are normal size. Customized Company Display: |
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| Product Tags: Electronic Components Potting Glue Potting Glue Surface Encapsulation Electronic two component glue |
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