China PUR Hot Melt Adhesives manufacturer
WUXI WANLI ADHESION MATERIALS CO., LTD.
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Structural Black Electronics Hot Glue Coil Reactive Hot Melt Adhesives PUR-8830H

Structural Black Electronics Hot Glue Coil Reactive Hot Melt Adhesives PUR-8830H

Brand Name WANLI-ADHESION
Model Number PUR-8830H
Certification ISO9001 ISO14001 IATF16949
Place of Origin CHINA
Minimum Order Quantity 30 ml
Payment Terms L/C, T/T
Delivery Time 5-8 work days
Packaging Details 30 ml/Plastic Tube
Product PUR Hot Melt Adhesive
Component PUR (Polyurethane)
Appearance Black Solid
Solid Content 100%
Shelf Life 6 Months
Melt Viscosity 3000~6000 cps@110℃
Operating Temperature About 110℃
Open Time 3~5 min@25℃
Density 1.06 g/cm3
Useage Scope Electronic Coil Bonding
Application Industry Electronics Structural Bonding
Detailed Product Description

Factory Made Electrical Structural Bonding Hot Melt Adhesives PUR-8830H

 
 Wanli® PUR hot melt adhesive PUR-8830H for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8830H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8830H is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, PUR-8830H has good peeling strength, good heat&humidity resistance and chemical resistance. PUR-8830H is especially suitable for bonding applications in the electronics industry.
 
APPLICATION
Wanli® PUR hot melt adhesive PUR-8830H is used for electronic structural bonding. PUR-8830H can be used for self-adhesive and inter-adhesive bonding of plastics such as PC, ABS, PVC and metals such as aluminum and stainless steel. PUR-8830H is especially suitable for bonding applications in the electronics industry.

 
Application MaterialElectrical Structural Bonding Hot Melt Adhesives
AppearanceBlack Solid
ComponentPUR (Polyurethane)
Application IndustryElectronics Structural Bonding
Solid Content100%
Operating TemperatureAbout 110℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity3000~6000cps@110℃ (Brookfield-ASTMD3236)
Open Time3~5min@25℃
Density1.06g/cm3
Usage ScopeElectronic Coil Bonding
Shelf Life6 Months
Package30 ml/Plastic Tube

 
 FEATURE
Stable viscosity under heating at a certain temperature.
High initial bonding strength and final bonding strength. 
With good peeling strength, good heat&humidity resistance and chemical resistance after curing.
 
USER GUIDE
The package of PUR-8830H is suitable for various dispensing equipment. 
Recommended working temperature is about 110℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).
 
STORAGE
Store in a dry, cool place and avoid di rect sunlight. Storage temperature should not exceed 35℃, avoid open flame or heat source.

 

Product Tags: structural electronics hot glue   black electronics hot glue   Coil reactive hot melt adhesives  
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