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Electronics Ic Chip Dual 4-Bit Non-Inverting Buffer / Driver 74LCX244WMX

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Electronics Ic Chip Dual 4-Bit Non-Inverting Buffer / Driver 74LCX244WMX

Brand Name FAIRCHILD
Model Number 74LCX244WMX
Certification Original Factory Pack
Place of Origin Thailand
Minimum Order Quantity 5pcs
Price Negotiation
Payment Terms T/T, Western Union,PayPal
Supply Ability 290PCS
Delivery Time 1 Day
Packaging Details please contact me for details
Description Buffer, Non-Inverting 2 Element 4 Bit per Element 3-State Output 20-SOIC
Supply Voltage −0.5 to +7.0
DC Input Voltage −0.5 to +7.0
DC Output Voltage −0.5 to +7.0
DC Input Diode Current −50
DC Output Diode Current −50
DC Output Source/Sink Current ±50
Detailed Product Description

74LCX244

Low Voltage Buffer/Line Driver

with 5V Tolerant Inputs and Outputs

 

General Description​

  The LCX244 contains eight non-inverting buffers with 3-STATE outputs. The device may be employed as a memory address driver, clock driver and bus-oriented transmitter/receiver. The LCX244 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment.

 

  The LCX244 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation.

 

 

 

 

Features

■ 5V tolerant inputs and outputs

■ 2.3V–3.6V VCC specifications provided

■ 6.5 ns tPD max (VCC = 3.3V), 10 µA ICC max

■ Power down high impedance inputs and outputs

■ Supports live insertion/withdrawal (Note 1)

■ ±24 mA output drive (VCC = 3.0V)

■ Implements patented noise/EMI reduction circuitry

■ Latch-up performance exceeds 500 mA

■ ESD performance: Human body model > 2000V Machine model > 200V

 

 

 

Order Number Package Number Package Description
74LCX244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX244SJM20D20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74LCX244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

 

Product Tags: electronics ic chip   integrated circuit components  
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