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SN74LVC1G125DBVR Integrated Circuit Chip Program Memory LCD Controller ICs

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SN74LVC1G125DBVR Integrated Circuit Chip Program Memory LCD Controller ICs

Brand Name TI
Model Number SN74LVC1G125DBVR
Certification Original Factory Pack
Place of Origin CHINA
Minimum Order Quantity 10pcs
Price Negotiation
Payment Terms T/T, Western Union,PayPal
Supply Ability 3120PCS
Delivery Time 1 Day
Packaging Details REEL
Description Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-23-5
Temperature Range –55°C to +150°C
Payment Term T/T, Paypal, Western Union
Voltage 7 V
Current 5A
Package SOP-20
Factory Package REEL
Detailed Product Description

SN74LVC1G125 (ACTIVE)

Single Bus Buffer Gate With 3-State Outputs

 

Description

 

This bus buffer gate is designed for 1.65-V to 5.5-V VCCoperation.

The SN74LVC1G125 device is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high.

The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating

 

Features

 

  • Available in the Ultra Small 0.64-mm2
    Package (DPW) With 0.5-mm Pitch
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.7 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC

 

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G125 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES223O–APRIL 1999–REVISED FEBRUARY 2007

• Available in the Texas Instruments

• I off Supports Partial-Power-Down Mode NanoStar™ and NanoFree™ Packages Operation

• Supports 5-V VCC Operation

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• Inputs Accept Voltages to 5.5 V • Max t

• ESD Protection Exceeds JESD 22 pd of 3.7 ns at 3.3 V

– 2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10-µA Max I CC

– 200-V Machine Model (A115-A)

• ±24-mA Output Drive at 3.3 V

– 1000-V Charged-Device Model (C101)

 

This bus buffer gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G125 is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I off . The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

 

ABSOLUTE MAXIMUM RATINGS(1)

Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . 7 V

 Input voltage, VI: ’LS. . . . . . . . . . . . . . . . . . . . . . . . 7 V

L’S . . . . . . . . . . . .. . . 5.5 V

Off-state output voltage . .  . . . . . . . . . . . 5.5 V

Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . .  70 C/W

DW package . . . . . . . . . . . . . . . . . . .  58 °C/W

N package . . . . . . . . . . . . . . . . . . . . . .  69 °C/W

NS package . . . . . . . . . . . . . . . . . . . . . . . . .60 °C/W

Storage temperature range, Tstg . . . . . . –65°C to 150°C

 

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