RF Integrated Circuit Chip BYG23M-E3/TR Ultrafast Avalanche SMD Rectifier

RF Integrated Circuit Chip BYG23M-E3-TR Ultrafast Avalanche SMD Rectifier

FEATURES

• Low profile package

• Ideal for automated placement

• Glass passivated junction

• Low reverse current

• High reverse voltage

• Ultra fast reverse recovery time

• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication.

MECHANICAL DATA

Case: DO-214AC (SMA) Epoxy meets UL 94V-0 flammability rating

Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC Q101 qualified), meets JESD 201 class 2 whisker test

Polarity: Color band denotes the cathode end

MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)

RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)