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ChongMing Group (HK) Int'l Co., Ltd
CHONGMING GROUP (HK) INT'L CO., LTD.
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PIC16F505-I/P Electronic IC Chips 8/14-Pin, 8-Bit Flash Microcontrollers

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ChongMing Group (HK) Int'l Co., Ltd

City: shenzhen

Country/Region:china

Tel:86-755-88367702

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Ms.Doris Guo
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PIC16F505-I/P Electronic IC Chips 8/14-Pin, 8-Bit Flash Microcontrollers

Model Number PIC16F505-I/P
Certification new & original
Place of Origin original factory
Minimum Order Quantity 10pcs
Price Negotiate
Payment Terms T/T, Western Union, Paypal
Supply Ability 7700pcs
Delivery Time 1 day
Packaging Details Please contact me for details
Description PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 1.5KB (1K x 12) FLASH 14-PDIP
Ambient temperature under bias -40°C to +125°C
Storage temperature -65°C to +150°C
Voltage on VDD with respect to VSS 0 to +6.5V
Voltage on MCLR with respect to VSS 0 to +13.5V
Voltage on all other pins with respect to VSS -0.3V to (VDD + 0.3V)
Total power dissipation 800 mW
Detailed Product Description

 

PIC12F508/509/16F505

8/14-Pin, 8-Bit Flash Microcontrollers

 

Devices Included In This Data Sheet:

• PIC12F508

• PIC12F509

• PIC16F505

 

High-Performance RISC CPU:

• Only 33 single-word instructions to learn

• All single-cycle instructions except for program branches, which are two-cycle

• 12-bit wide instructions

• 2-level deep hardware stack

• Direct, Indirect and Relative Addressing modes for data and instructions

• 8-bit wide data path

• 8 Special Function Hardware registers

• Operating speed:

  - DC – 20 MHz clock input (PIC16F505 only)

  - DC – 200 ns instruction cycle (PIC16F505 only)

  - DC – 4 MHz clock input

  - DC – 1000 ns instruction cycle

 

Special Microcontroller Features:

• 4 MHz precision internal oscillator:

  - Factory calibrated to ±1%

• In-Circuit Serial Programming™ (ICSP™)

• In-Circuit Debugging (ICD) support

• Power-on Reset (POR)

• Device Reset Timer (DRT)

• Watchdog Timer (WDT) with dedicated on-chip RC oscillator for reliable operation

• Programmable code protection

• Multiplexed MCLR input pin

• Internal weak pull-ups on I/O pins

• Power-saving Sleep mode

• Wake-up from Sleep on pin change

• Selectable oscillator options:

  - INTRC: 4 MHz precision Internal oscillator

  - EXTRC: External low-cost RC oscillator

  - XT: Standard crystal/resonator

  - HS: High-speed crystal/resonator (PIC16F505 only)

  - LP: Power-saving, low-frequency crystal

  - EC: High-speed external clock input (PIC16F505 only)

 

Low-Power Features/CMOS Technology:

• Operating Current:

  - < 350 μA @ 2V, 4 MHz

• Standby Current:

  - 100 nA @ 2V, typical

• Low-power, high-speed Flash technology:

  - 100,000 Flash endurance

  - > 40 year retention

• Fully static design

• Wide operating voltage range: 2.0V to 5.5V

• Wide temperature range:

  - Industrial: -40°C to +85°C

  - Extended: -40°C to +125°C

 

Peripheral Features (PIC12F508/509):

• 6 I/O pins:

  - 5 I/O pins with individual direction control

  - 1 input only pin

  - High current sink/source for direct LED drive

  - Wake-on-change

  - Weak pull-ups

• 8-bit real-time clock/counter (TMR0) with 8-bit programmable prescaler

 

Peripheral Features (PIC16F505):

• 12 I/O pins:

  - 11 I/O pins with individual direction control

  - 1 input only pin

  - High current sink/source for direct LED drive

  - Wake-on-change

  - Weak pull-ups

• 8-bit real-time clock/counter (TMR0) with 8-bit programmable prescaler

 

Pin Diagrams

 

 

Absolute Maximum Ratings(†)

Ambient temperature under bias.......................................................................-40°C to +125°C

Storage temperature ........................................................................................-65°C to +150°C

Voltage on VDD with respect to VSS ...........................................................................0 to +6.5V

Voltage on MCLR with respect to VSS.......................................................................0 to +13.5V

Voltage on all other pins with respect to VSS ........................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ..............................................................................................800 mW

 

Max. current out of VSS pin .............................................................................................200 mA

Max. current into VDD pin.................................................................................................150 mA

Input clamp current, IIK (VI < 0 or VI > VDD)......................................................................±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................±20 mA

Max. output current sunk by any I/O pin .............................................................................25 mA

Max. output current sourced by any I/O pin ........................................................................25 mA

Max. output current sourced by I/O port .............................................................................75 mA

Max. output current sunk by I/O port ...................................................................................75 mA


Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)

†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

 

 

 

 

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