ADC0820CCN Electronic IC Chips 8-Bit High Speed Compatible A/D Converter
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ADC0820 8-Bit High Speed µP Compatible A/D Converter with Track/Hold Function
General Description By using a half-flash conversion technique, the 8-bit ADC0820 CMOS A/D offers a 1.5 µs conversion time and dissipates only 75 mW of power. The half-flash technique consists of 32 comparators, a most significant 4-bit ADC and a least significant 4-bit ADC.
The input to the ADC0820 is tracked and held by the input sampling circuitry eliminating the need for an external sample-and-hold for signals moving at less than 100 mV/µs. For ease of interface to microprocessors, the ADC0820 has been designed to appear as a memory location or I/O port without the need for external interfacing logic.
Key Specifications • Resolution 8 Bits • Conversion Time 2.5 µs Max (RD Mode) 1.5 µs Max (WR-RD Mode) • Low Power 75 mW Max • Total Unadjusted Error ±1⁄2 LSB and ± 1 LSB
Features • Built-in track-and-hold function • No missing codes • No external clocking • Single supply — 5 VDC • Easy interface to all microprocessors, or operates stand-alone • Latched TRI-STATE® output • Logic inputs and outputs meet both MOS and T2 L voltage level specifications • Operates ratiometrically or with any reference value equal to or less than VCC
• 0V to 5V analog input voltage range with single 5V supply • No zero or full-scale adjust required • Overflow output available for cascading • 0.3" standard width 20-pin DIP • 20-pin molded chip carrier package • 20-pin small outline package • 20-pin shrink small outline package (SSOP)
Connection and Functional Diagrams
Absolute Maximum Ratings (Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (VCC) 10V Logic Control Inputs −0.2V to VCC +0.2V Voltage at Other Inputs and Output −0.2V to VCC +0.2V Storage Temperature Range −65˚C to +150˚C Package Dissipation at TA = 25˚C 875 mW Input Current at Any Pin (Note 5) 1 mA Package Input Current (Note 5) 4 mA ESD Susceptability (Note 9) 1200V Lead Temp. (Soldering, 10 sec.) Dual-In-Line Package (plastic) 260˚C Dual-In-Line Package (ceramic) 300˚C Surface Mount Package Vapor Phase (60 sec.) 215˚C Infrared (15 sec.) 220˚C
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