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676-BGA Programmable IC Chip XC3S1400AN-4FGG676I Field Programmable Gate Array

676-BGA Programmable IC Chip XC3S1400AN-4FGG676I Field Programmable Gate Array

Brand Name AMD Xilinx
Model Number XC3S1400AN-4FGG676I
Certification ISO9001
Minimum Order Quantity >=1pcs
Price request for need
Payment Terms Escrow, L/C, D/A, D/P, T/T, Western Union,
Supply Ability 100000 Acre/Acres per Day+pcs+1-2days
Delivery Time 2-3days
Packaging Details Original factory sealed packing with standard types: tube,tray,tape and reel,box,bag packing. Or request for your need.
Place of Origin China
Detailed Description Spartan®-3AN Field Programmable Gate Array (FPGA) IC 502 589824 25344 676-BGA
Product Status Active
Package / Case 676-BGA
Program Memory Type: Flash
Output Power: standard
Operating Voltage: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C
Base Product Number XC3S1400
Detailed Product Description

XC3S1400AN-4FGG676I Field Programmable Gate Array (FPGA) IC 502 589824 25344 676-BGA

 

PRODUCT DESCRIPTION

 

Part number XC3S1400AN-4FGG676I is manufactured by AMD Xilinx and distributed by Stjk. As one of the leading distributors of electronic products, we carry many electronic components from the world's top manufacturers.

 

For more information on XC3S1400AN-4FGG676I detailed specifications, quotations, lead times, payment terms and more, please do not hesitate to contact us. In order to process your enquiry, please add the quantity XC3S1400AN-4FGG676I to your message. Send an email to stjkelec@hotmail.com for a quote now.

 

PRODUCT PROPERTIES

Product Status
Active
Number of LABs/CLBs
2816
Number of Logic Elements/Cells
25344
Total RAM Bits
589824
Number of I/O
502
Number of Gates
1400000
Voltage - Supply
1.14V ~ 1.26V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
676-BGA
Supplier Device Package
676-FBGA (27x27)
Base Product Number
XC3S1400

 

 

Product Tags: 676-BGA Programmable IC Chip   Field Programmable IC Chip   XC3S1400AN-4FGG676I   
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