FR4 TG135 2-layer PCB ENIG 2u surface 0.075mm
FR4 TG135 is a substrate material used in the manufacture of
printed circuit boards (PCBs). Its glass transition temperature
(Tg) of 135°C indicates that it can withstand moderate temperatures
during operation without losing its mechanical or electrical
properties. A 2-layer PCB made with FR4 TG135 material refers to a
PCB with two layers of substrate material and copper traces.
ENIG (Electroless Nickel Immersion Gold) is a surface treatment
applied to copper traces and pads on the surface of PCBs. It
involves depositing a layer of nickel over copper, followed by an
immersion gold layer. This surface treatment provides excellent
protection against oxidation and other forms of corrosion and is
often used in high-reliability applications.
The 2u surface refers to the gold layer thickness of the ENIG
finish. A 2u surface means that the immersion gold layer is 2
microns thick, which is the standard thickness for many ENIG
finishes.
0.075 mm (75 microns) refers to the minimum track/clearance
capability of the PCB. This means that the minimum distance between
two copper lines on the surface of the PCB is 0.075mm, which
indicates that the PCB is suitable for high-density applications
where space is at a premium.
PCB Layer | 2L | PCB material | FR4 |
Copper thickness | 1/1/1/1OZ | PCB thickness | 1.0MM |
Min. hole size | 0.2mm | Min.PCB track/gap: | 3/3mil |
PCB solder mask | Green | PCB silkscreen | White |
PCB surface finished | ENIG 2u | PCB outline | Routing/V-CUT |
Application | electronic toy |
Special requirement: | small line space and gap:3/3mil/min. via hole size 0.15mm |
Shenzhen Jieteng Circuit Co., Ltd.
Since its establishment in 2009, it has been committed to the
production of PCB circuit boards