| JINHUA PCB Standard Capability |
| Item | Process | Manufacturing Capability | Remark |
| 1 | Surface Finishing | HASL, HASL LF, ENIG, gold fingers plating, OSP, Immersion Ag,
Immersion Sn, Carbon Ink, peelable mask, plug vias with resin | |
| 2 | Board Thickness | 0.1 MM ~ 8.0 MM | |
| 3 | Layers | 1 ~ 32 L | |
| 4 | Material | Brand: KB, ITEQ, Shengyi, Huazheng,NanYa, CEM, Arlon,Rogers,
Teflon, Polymide, panasonic, Aluminum Base, Halogen Free,Peters
Soldermask,Kapton high temperature tape, Taiyo Ink | |
| TG: low to high, TG135 to TG180; CTI: 175 to 600 | |
| 5 | Board Size | Max board size:650 x 1200 MM; Min board size: 3*3 MM | |
| 6 | Inner Layer | (1) ring of line: single sided 4mil | Aspect ratio:10: 1 |
| (2) min trace w/s for 1 OZ:3 mil/2.6mil | Max finished copper thickness:18/18 oz |
| (3) hole to line or pad spacing: min 6mil | |
| 7 | Drilling | (1) min finished hole size: laser 0.1mm mechanical 0.15mm | |
| (2) PTH hole size tolerance: ± 3 mil,NPTH hole size tolerance: ± 2
mil | hole position registration tolerance: ± 2 mil |
| (3) min slot size:0.55 mm | |
| 8 | Outer Layer | (1) 1oz: 3/3 mil, 2oz:5/5 mil | Max finished copper thickness:18/18 oz |
| 9 | Plating | (1) hole wall copper thickness 1-10 mil | |
| (2) 10:1 | |
| 10 | Soldermask | (1) min soldermaks bridge 4mil | min PAD 20 mil |
| 11 | Silkscreen | Color:white, black, yellow, red...etc. | Serial number, Barcode, QR code |
| 12 | Profiling | (1) Tolerance of outline: ± 0.1mm | |
| (2) V-CUT Angle: 30 degree & 45 degree | min V-Cut width 75 MM |
(3) Depth:Board thickness≥1.2 mm Remain thicknss: 1/3;
Board thickness≤1.2 mm, remain thickness 20 mil (0.5 mm) | min distance V-Cut to copper 0.4 MM |
| (4) Bevelling angle/depth: 20°/1.8 mm;30° /1.0 mm;45°/0.5
mm;tolerance:± 5°/± 0.2 mm | |
| 13 | Bow and Twist | 1L≤1.0% 2L≤0.75% Multi layers≤0.75% | |
| 14 | Monthly Capcity | 120,000 M2 | |
