PCBA program development design FR4 multilayer circuit board thick
copper plate production processing Essential details - Model Number:
PCB
- Type:
Multilayer pcb
- Place of Origin:
Guangdong, China
- Brand Name:
JIETENG
- Number of Layers:
2 layers 4 layers
- Base Material:
FR-4, FR-4
- Copper Thickness:
1/2 oz min; 12 oz max
- Board Thickness:
0.2mm-6mm(8mil-126mil)
- Min. Hole Size:
0.1mm(4mil)
- Min. Line Width:
0.075mm(3mil)
- Min. Line Spacing:
0.1mm(4mil)
- Surface Finishing:
HASL / HASL lead free, OSP, ENIG, Gold Plating
- Board Size:
all
- Product name:
OEM pcb controller board for guitar/bass pedals blank PCB board
- Service:
One-stop Service
- Solder mask color:
Black.Red.Yellow.White.Blue.Green
- Material:
FR4 /aluminum/FR-4 CTI300
| PCB Manufacture Capacity | | Item | Specification | | Material | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. | | Remarks | High Tg CCL is Available(Tg>=170℃) | | Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) | | Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating
Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) | | Shape | Routing,Punch,V-cut,Chamfer | | Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um,
Block, BGA) | | Silkscreen(black, yellow, white) | | Peel able-mask(red, blue, thickness>=300um) | | Minimum Core | 0.075mm(3mil) | | Copper Thickness | 1/2 oz min; 12oz max | | Min Trace Width & Line Spacing | 0.075mm/0.075mm(3mil/3mil) | | Min Hole Diameter for CNC Drilling | 0.1mm(4mil) | | Min Hole Diameter for Punching | 0.6mm(35mil) | | Biggest panel size | 610mm * 508mm | | Hole Position | +/-0.075mm(3mil) CNC Drilling | | Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original | | Hole Diameter(H) | PTHL:+/-0.075mm(3mil) | | Non PTHL:+/-0.05mm(2mil) | | Outline Tolerance | +/-0.1mm(4mil) CNC Routing | | Warp & Twist | 0.70% | | Insulation Resistance | 10Kohm-20Mohm | | Conductivity | <50ohm | | Test Voltage | 10-300V | | Panel Size | 110 x 100mm(min) | | 660 x 600mm(max) | | Layer-layer misregistration | 4 layers:0.15mm(6mil)max | | 6 layers:0.25mm(10mil)max | | Min spacing between hole edge to circuitry pattern of an inner
layer | 0.25mm(10mil) | | Min spacing between board outline to circuitry pattern of an inner
layer | 0.25mm(10mil) | | Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
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