Keyboard and mouse key board PCB circuit board PCB motherboard
control board PCBA electronic product development Essential details - Model Number:
PCBA 0003
- Type:
all types, pcb & pcba
- Place of Origin:
Guangdong, China
- Brand Name:
JIERENG
- Copper Thickness:
customized, 1oz 2oz 3oz 4oz 5oz
- Product name:
electronics circuit board
- use:
electronic product
- shape:
irregular
- packaging:
carton box
- Base Material:
FR4/ROGERS/Aluminum/High TG
- Keywords:
pcba service
- Solder Mask:
Green,Black,Blue,Red,Matt Green
- Service:
OEM /ODM
| Material Technology | Our Production | General Production | Regular/Special | 1.Our (TG170)FR4:
high quality materials, excellent heat resistance, won't distort
break in high temperature, no foaming, no burning, good
performance in electrical charge, impact resistance,
humidity-resistance
2.Our FR4
good performance in electrical charge, impact resistance,
humidity-resistance
3.Our CEM
no-burr
4.Our Rogers
Good performance in high frequency
5.Our Aluminum
Excellent heat dispersion | 1.General FR4
High heat work
2.General CEM
Expand and deform in damp conditions | Factory | We have automatic production line. The automatic production line
improves the precision and efficiency of PCB producing,it makes
surface brighter, cleaner and more smooth, and it helps reduce the
cost. | Artificial production line | Blind/buried via board, High Density Interconnect(1+1,N+1) | Application of HDI technology reducing the thickness and the volume
of PCB boards, increasing the density of 3-D wiring design. | Difficult manufacturer, high cost | Impedance | Good performance in reliability and stability of signal sending and
receiving | High cost | Surface Technics | 1.IMG:smooth surface, good adhesion, no oxidation under long using
2.gold plating(thick gold:1-50U"):good wear-resistance
3.HASL:better price, not easy oxidation, easy to welding, smooth
surface
4.HAL: better price, not easy oxidation, easy to welding | 1.IMG:high price
2.Gold plating(thick gold):high price
3.HAL:surface is not flat, not suitable for BAG packaging | Copper Via/Surface(20-25UM,0.5-60Z) | Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM | Hard to reach 0.1MM | Multilayer board(4-20 L),BGA(CPU) | BGA:high density, high performance, multifunctional, increase
thermal reliability, good performance in electroheat property, MIN
width/space: 3/3MIL
Multilayer board:strong microporous, high reliability | Difficult manufacturer,high cost | Test | To assure quality, avoid wasting after installing and scraping,
save cost, save the time of rework | Careless |
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