OEM Ceramic Heatsink Waterproof Heat Spreader For Power Module CPU
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Light weight Ceramic heat sink heat spreader for Power Module and CPU Ceramic heatsink’s material is silicon carbide, offers supreme thermal conductivity, electrical insulation, and light– weight, combining efficiency and sustainability in one. Thanks to non-metallic material characteristics, it has no Electromagnetic Interference (EMI) nor Electromagnetic compatibility (EMD) issues; and it is anti-oxidation, corrosion-resistant, waterproof, electrical isolation and sustainable. Compared to traditional Aluminum or Copper solutions, it has larger surface area generated by the porous structure and higher level of thermal radiation. It is 30% lighter than Alumninum. A simplified structure has a direct bond between heat-source and heat sink create superior thermal conductivity and electric insulation feature increases components’ life and stability in the entire assembly. SpecificationLength (mm) Min 8.5 Max 85 Width (mm) Min 8.5 Max 70 Height Min 1.2 Max 15 Fin thickness (mm) Min - Max - Pitch Min - Max - Torque rate - Material SiC/ AL2O3/ SIO2 |
| Product Tags: OEM Ceramic Heatsink Ceramic Heatsink Waterproof |
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Ceramic Heat Sink for High-Temperature Electronics - Various Sizes |
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Long-lasting Ceramic Heat Sink Large Surface Area For Temperature Control |
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Lightweight Ceramic Heat Spreader / Light Weights with Ultralow Surface Roughness |
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High Breakdown Voltage/ High Resistance Ceramic Heat Sink With 0.3-08Um Surface Roughness |
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Optimize Heat Dissipation Ceramic Heat Sink for Electronic Devices in Extreme Conditions |
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Durable SiC Ceramic Heat Sink for Optimal Performance in Extreme Conditions Heat Dissipation Optimization |