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Shenzhen Sai Collie Technology Co., Ltd.
Shenzhen Sai Collie Technology Co., Ltd.
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XC7A75T-1CSG324C Xilinx FPGA Field Programmable Gate Array IC Chip

XC7A75T-1CSG324C Xilinx FPGA Field Programmable Gate Array IC Chip

Brand Name XILINX / AMD
Model Number XC7A75T-1CSG324C
Place of Origin original
Minimum Order Quantity 1
Price Negotiable
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 999999
Delivery Time 1-3 days
Packaging Details standard
Number of LogNumber of LABs/CLBs 1879
Total RAM Bitsage (Vdss) 958464
Number of I/ODrain (Id) @ 25°C 190
Voltage - Supplyds On, Min Rds On) 1.14V ~ 1.26V
Operating Temperature -40°C ~ 100°C (TJ)
Mounting Type Surface Mount
PN XC7A75T-1CSG324C
Detailed Product Description

XC7A75T-1CSG324C  Xilinx FPGA Field Programmable Gate Array Package 484-BBGA

Voltage Supply 0.95V ~ 1.05V

 

Number of LABs/CLBs
4075
Number of Logic Elements/Cells
52160
Total RAM Bits
2764800
Number of I/O
250
Voltage - Supply
0.95V ~ 1.05V
Mounting Type
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
Supplier Device Package
484-FBGA (23x23)

 

 

Product Listing: Programmable IC Chip - XC7A75T-1CSG324C

Product Name: Programmable IC Chip - XC7A75T-1CSG324C

Product Description: The Programmable IC Chip - XC7A75T-1CSG324C is a high-performance integrated circuit designed for programmable logic applications. It offers advanced features and capabilities, making it suitable for a wide range of electronic projects and applications.

Product Specifications:

  • Model: XC7A75T-1CSG324C
  • Package Type: 324-pin Ceramic Ball Grid Array (CSG324)
  • Manufacturer: Xilinx
  • Operating Temperature: -40°C to 100°C
  • Logic Cells: 75,000
  • Maximum User I/O Pins: 200
  • Block RAM: 4,860 Kbits
  • DSP Slices: 120
  • Clock Management Tiles: 4
  • JTAG Boundary Scan Support: Yes
  • Configuration Memory: Non-volatile Flash
  • Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage

Key Features:

  • High-performance programmable logic device
  • Ceramic Ball Grid Array (CSG324) package for durability and reliability
  • Abundant logic cells for complex designs
  • Extensive I/O pins for versatile connectivity
  • Large block RAM for data storage and processing
  • Dedicated DSP slices for demanding signal processing tasks
  • Multiple clock management tiles for precise timing control
  • JTAG boundary scan support for easy debugging and testing
  • Non-volatile flash for secure configuration storage
  • Wide operating temperature range for various environments
  • Low power consumption for energy-efficient designs

Applications:

  • High-speed data processing and networking applications
  • Digital signal processing and multimedia systems
  • Industrial automation and control systems
  • Aerospace and defense electronics
  • Test and measurement instruments
  • Medical devices and equipment
  • Telecommunications and networking equipment
  • Automotive electronics and infotainment systems

 

 

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How to buy >>>
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Service >>>
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