XC7S50-2CSGA324I IC Chip Programming FPGAs Wide Variety Of Configuration Options
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XC7S50-2CSGA324I Programmable IC Chip 324-CSPBGA Package Wide variety of configuration options
XC7S50-2CSGA324I
XC7S50-2CSGA324I
• Quickly deploy embedded processing with MicroBlaze™
processor. • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs. • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction. • Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option. • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
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