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Shenzhen Sai Collie Technology Co., Ltd.
Shenzhen Sai Collie Technology Co., Ltd.
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IRLR2705TRPBF MOSFET Power Electronics N-Channel dissipation levels 1.5 Package TO-252

IRLR2705TRPBF MOSFET Power Electronics N-Channel dissipation levels 1.5 Package TO-252

Brand Name Infineon
Model Number IRLR2705TRPBF
Place of Origin original
Minimum Order Quantity 1
Price Negotiable
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 999999
Delivery Time 1-3 days
Packaging Details standard
FET Type N-Channel
Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 55 V
Current - Continuous Drain (Id) @ 25°C 28A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 4V, 10V
Rds On (Max) @ Id, Vgs 40mOhm @ 17A, 10V
Detailed Product Description

IRLR2705TRPBF MOSFET Power Electronics N-Channel   dissipation levels  1.5 Package TO-252

 

 

FET Type
Technology
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)
Current - Continuous Drain (Id) @ 25°C
Drive Voltage (Max Rds On, Min Rds On)
4V, 10V
Rds On (Max) @ Id, Vgs
40mOhm @ 17A, 10V
Vgs(th) (Max) @ Id
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs
25 nC @ 5 V
Vgs (Max)
±16V
Input Capacitance (Ciss) (Max) @ Vds
880 pF @ 25 V
FET Feature
-
Power Dissipation (Max)
68W (Tc)
Operating Temperature
-55°C ~ 175°C (TJ)
Mounting Type
Supplier Device Package
D-Pak
Package / Case

 

 

Logic-Level Gate Drive
Ultra Low On-Resistance
Surface Mount (IRLR2705)
Straight Lead (IRLU2705)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated

 

Description
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on-resistance persilicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a widevariety of applications.
The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.

 

 

 

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