XCZU7EV-3FBVB900E

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Shenzhen Xinhuo Future Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18138855450

Contact Person:
Mr.Ken Chen View Contact Details

XCZU7EV-3FBVB900E

Category	Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number	XCZU7
Product Status	Active
Peripherals	DMA, WDT
Primary Attributes	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Series	Zynq® UltraScale+™ MPSoC EV
Package	Tray
Mfr	AMD
Supplier Device Package	900-FCBGA (31x31)
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature	0°C ~ 100°C (TJ)
Architecture	MCU, FPGA
Package / Case	900-BBGA, FCBGA
Number of I/O	204
RAM Size	256KB
Speed	600MHz, 1.5GHz
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size	-
Description	IC SOC CORTEX-A53 900FCBGA
Stock	In Stock
Shipping Method	LCL, AIR, Express
Payment Terms	L/C, D/A, D/P, T/T, Western Union, MoneyGram

Detailed Product Description

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 600MHz, 1.5GHz 900-FCBGA (31x31)

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