XCVM1802-2MLEVFVC1760

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Shenzhen Xinhuo Future Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18138855450

Contact Person:
Mr.Ken Chen View Contact Details

XCVM1802-2MLEVFVC1760

Category	Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status	Active
Peripherals	DDR, DMA, PCIe
Primary Attributes	Versal™ Prime FPGA, 1.9M Logic Cells
Series	Versal™ Prime
Package	Tray
Mfr	AMD
Supplier Device Package	1760-FCBGA (40x40)
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature	0°C ~ 100°C (TJ)
Architecture	MPU, FPGA
Package / Case	1760-BFBGA, FCBGA
Number of I/O	500
RAM Size	256KB
Speed	600MHz, 1.4GHz
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size	-
Description	IC VERSAL AICORE FPGA 1760BGA
Stock	In Stock
Shipping Method	LCL, AIR, Express
Payment Terms	L/C, D/A, D/P, T/T, Western Union, MoneyGram

Detailed Product Description

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.9M Logic Cells 600MHz, 1.4GHz 1760-FCBGA (40x40)

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