XCZU9EG-2FFVB1156I

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Shenzhen Xinhuo Future Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18138855450

Contact Person:
Mr.Ken Chen View Contact Details

XCZU9EG-2FFVB1156I

Category	Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number	XCZU9
Product Status	Active
Peripherals	DMA, WDT
Primary Attributes	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Series	Zynq® UltraScale+™ MPSoC EG
Package	Tray
Mfr	AMD
Supplier Device Package	1156-FCBGA (35x35)
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature	-40°C ~ 100°C (TJ)
Architecture	MCU, FPGA
Package / Case	1156-BBGA, FCBGA
Number of I/O	328
RAM Size	256KB
Speed	533MHz, 600MHz, 1.3GHz
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size	-
Description	IC SOC CORTEX-A53 1156FCBGA
Stock	In Stock
Shipping Method	LCL, AIR, Express
Payment Terms	L/C, D/A, D/P, T/T, Western Union, MoneyGram

Detailed Product Description

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

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