XCVM1302-2LSENSVF1369

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Beijing Silk Road Enterprise Management Services Co.,Ltd.

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XCVM1302-2LSENSVF1369

Category	Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status	Active
Peripherals	DDR, DMA, PCIe
Primary Attributes	Versal™ Prime FPGA, 70k Logic Cells
Series	Versal™ Prime
Package	Tray
Mfr	AMD
Supplier Device Package	1369-BGA (35x35)
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature	0°C ~ 100°C (TJ)
Architecture	MPU, FPGA
Package / Case	1369-BFBGA
Number of I/O	316
RAM Size	-
Speed	450MHz, 1.08GHz
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size	-
Description	IC VERSALPRIME ACAP FPGA 1369BGA
Stock	In Stock
Shipping Method	LCL, AIR, FCL, Express
Payment Terms	L/C, D/A, D/P, T/T, Western Union,
Model Number	XCVM1302-2LSENSVF1369

Detailed Product Description

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 450MHz, 1.08GHz 1369-BGA (35x35)

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