IS43LR16200D-6BL-TR IC DRAM 32MBIT PARALLEL 60TFBGA ISSI, Integrated Silicon Solution Inc
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Detailed Product Description
Product Details
FEATURES• Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V• Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V • High speed data transfer rates with system frequency up to 933 MHz • 8 internal banks for concurrent operation • 8n-Bit pre-fetch architecture • Programmable CAS Latency • Programmable Additive Latency: 0, CL-1,CL-2 • Programmable CAS WRITE latency (CWL) based on tCK • Programmable Burst Length: 4 and 8 • Programmable Burst Sequence: Sequential or Interleave • BL switch on the fly • Auto Self Refresh(ASR) • Self Refresh Temperature(SRT) • Refresh Interval: 7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C 3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C • Partial Array Self Refresh • Asynchronous RESET pin • TDQS (Termination Data Strobe) supported (x8 only) • OCD (Off-Chip Driver Impedance Adjustment) • Dynamic ODT (On-Die Termination) • Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω) • Write Leveling • Up to 200 MHz in DLL off mode • Operating temperature: Commercial (TC = 0°C to +95°C) Industrial (TC = -40°C to +95°C) Automotive, A1 (TC = -40°C to +95°C) Automotive, A2 (TC = -40°C to +105°C)
Specifications
DescriptionsSDRAM - Mobile LPDDR Memory IC 32Mb (2M x 16) Parallel 166MHz 5.5ns
60-TFBGA (8x10) DRAM Chip DDR SDRAM 32Mbit 2Mx16 1.8V 60-Pin TFBGA T/R DRAM 32M, 1.8V, M-DDR 2Mx16, 166Mhz, RoHS |
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