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Sanhuang electronics (Hong Kong) Co., Limited
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W25Q128JVCIQ TR IC FLASH 128MBIT SPI 24TFBGA Winbond Electronics

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Sanhuang electronics (Hong Kong) Co., Limited

City: shenzhen

Country/Region:china

Tel:86-755-88859989

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Miss.Zhao
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W25Q128JVCIQ TR IC FLASH 128MBIT SPI 24TFBGA Winbond Electronics

Brand Name Winbond Electronics
Model Number W25Q128JVCIQ TR
Minimum Order Quantity 1
Price Based on current price
Payment Terms T/T
Supply Ability In stock
Delivery Time 3-5 work days
Packaging Details anti-static bag & cardboard box
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 128Mbit
Memory Organization 16M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3ms
Access Time -
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-TFBGA (6x8)
Detailed Product Description

Product Details

 

GENERAL DESCRIPTION

The W25Q128BV (8M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down.

 

 

FEATURES

• Family of SpiFlash Memories
– W25Q128BV: 128M-bit/16M-byte
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• Highest Performance Serial Flash
– 104/70MHz Dual Output/Quad SPI clocks
– 208/280MHz equivalent Dual /Quad SPI
– 35MB/S continuous data transfer rate
– Up to 5X that of ordinary Serial Flash
– More than 100,000 erase/program cycles(1)
– More than 20-year data retention
• Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down current
– -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program one to 256 bytes
– Erase/Program Suspend & Resume
• Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Lock-Down and OTP array protection
– 64-Bit Unique Serial Number for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
– 8-pad WSON 8x6-mm
– 16-pin SOIC 300-mil
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options

 

Specifications

AttributeAttribute Value
ManufacturerWinbond Electronics
Product CategoryMemory ICs
SeriesSpiFlash®
PackagingTape & Reel (TR) Alternate Packaging
Package-Case24-TBGA
Operating-Temperature-40°C ~ 85°C (TA)
InterfaceSPI Serial
Voltage-Supply2.7 V ~ 3.6 V
Supplier-Device-Package24-TFBGA (6x8)
Memory Capacity128M (16M x 8)
Memory-TypeFLASH - NOR
Speed104MHz
Format-MemoryFLASH

Descriptions

FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O 133MHz 24-TFBGA (6x8)
SPIFLASH, 128M-BIT, DTR, 4KB U
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