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Sanhuang electronics (Hong Kong) Co., Limited
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MT49H16M18SJ-25:B TR IC DRAM 288MBIT PARALLEL 144FBGA Micron Technology Inc.

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Sanhuang electronics (Hong Kong) Co., Limited

City: shenzhen

Country/Region:china

Tel:86-755-88859989

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MT49H16M18SJ-25:B TR IC DRAM 288MBIT PARALLEL 144FBGA Micron Technology Inc.

Brand Name Micron Technology Inc.
Model Number MT49H16M18SJ-25:B TR
Minimum Order Quantity 1
Price Based on current price
Payment Terms T/T
Supply Ability In stock
Delivery Time 3-5 work days
Packaging Details anti-static bag & cardboard box
Memory Type Volatile
Memory Format DRAM
Technology DRAM
Memory Size 288Mbit
Memory Organization 16M x 18
Memory Interface Parallel
Clock Frequency 400 MHz
Write Cycle Time - Word, Page -
Access Time 20 ns
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 144-TFBGA
Supplier Device Package 144-FBGA (18.5x11)
Detailed Product Description

Product Details

 

GENERAL DESCRIPTION

The Micron® 256Mb Reduced Latency DRAM (RLDRAM) contains 8 banks x32Mb of memory accessible with 32-bit or 16-bit I/Os in a double data rate (DDR) format where the data is provided and synchronized with a differential echo clock signal. RLDRAM does not require row/column address multiplexing and is optimized for fast random access and high-speed bandwidth.
RLDRAM is designed for communication data storages like transmit or receive buffers in telecommunication systems as well as data or instruction cache applications requiring large amounts of memory.

 

 

FEATURES

• 2.5V VEXT, 1.8V VDD, 1.8V VDDQ I/O
• Cyclic bank addressing for maximum data out bandwidth
• Non-multiplexed addresses
• Non-interruptible sequential burst of two (2-bit
prefetch) and four (4-bit prefetch) DDR
• Target 600 Mb/s/p data rate
• Programmable Read Latency (RL) of 5-8
• Data valid signal (DVLD) activated as read data is available
• Data Mask signals (DM0/DM1) to mask first and
second part of write data burst
• IEEE 1149.1 compliant JTAG boundary scan
• Pseudo-HSTL 1.8V I/O Supply
• Internal Auto Precharge
• Refresh requirements: 32ms at 100°C junction
temperature (8K refresh for each bank, 64K refresh
command must be issued in total each 32ms)

 

Specifications

AttributeAttribute Value
ManufacturerMicron Technology Inc.
Product CategoryMemory ICs
Series-
PackagingTape & Reel (TR) Alternate Packaging
Package-Case144-TFBGA
Operating-Temperature0°C ~ 95°C (TC)
InterfaceParallel
Voltage-Supply1.7 V ~ 1.9 V
Supplier-Device-Package144-μBGA (18.5x11)
Memory Capacity288M (16M x 18)
Memory-TypeRLDRAM 2
Speed2.5ns
Format-MemoryRAM

Descriptions

DRAM Memory IC 288Mb (16M x 18) Parallel 400MHz 20ns 144-FBGA (18.5x11)
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