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Sanhuang electronics (Hong Kong) Co., Limited
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Multiscene FPGA Integrated Circuit Surface Mount XC7K325T-2FFG900I 500 I/O

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Sanhuang electronics (Hong Kong) Co., Limited

City: shenzhen

Country/Region:china

Tel:86-755-88859989

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Miss.Zhao
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Multiscene FPGA Integrated Circuit Surface Mount XC7K325T-2FFG900I 500 I/O

Brand Name AMD
Model Number XC7K325T-2FFG900I
Minimum Order Quantity 1
Price Based on current price
Payment Terms T/T
Supply Ability In stock
Delivery Time 3-5 work days
Packaging Details anti-static bag & cardboard box
Number of LABs/CLBs 25475
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of I/O 500
Number of Gates -
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Detailed Product Description

XC7K325T-2FFG900I IC FPGA 500 I/O 900FCBGA AMD

Product Details

XC7K325T-2FFG900I Description

The Xilinx Kintex®-7 FPGA family provide your designs with the best price/performance/watt at 28nm while giving you high DSP ratios, cost effective packaging and support for mainstream standards like PCIe® Gen3 and 10gigabit Ethernet. Optimized for best price-performance with a 2X improvement compared to previous generation enabling a new class of FPGAs. It features up to 478K logic cells, 34Mb block RAM, 1920 DSP slices, 2845 GMAC/s DSP performance, 32 transceivers, 12.5Gb/s transceiver speed, 800Gb/s serial bandwidth, x8 Gen2 PCIe interface, 500 I/O pins, VCXO component, advanced extensible interface 4 (AXI4) IP, agile mixed signal (AMS) integration and 1.2 to 3.3V I/O voltage. The Kintex®-7 family ideal for applications including 3G and 4G wireless, flat panel displays and video over IP solutions.


XC7K325T-2FFG900I Features

-3, -2, -1, -1L, -2L speed grade options with 0 to 85°C/0°C to 100°C/-40°C to 100°C temperatures
Programmable system integration, increased system performance, BOM cost reduction
Total power reduction (50% lower power than previous generation 40nm devices)
Accelerated design productivity, scalable optimized architecture, comprehensive tools and IP
State-of-the-art, high performance, low power (HPL), 28nm, high-k metal gate (HKMG) technology
Powerful clock management tiles combining phase-locked loop and mixed-mode clock manager blocks
Lidless flip chip and high performance flip-chip package options
Kintex®-7 FPGA provides high speed serial connectivity with built-in multi gigabit transceivers
User configurable analogue interface (XADC), real 6-input lookup table (LUT) technology
High performance SelectIO™ technology with support for DDR3 interfaces up to 1866Mb/s

Specifications

AttributeAttribute Value
ManufacturerXilinx
Product CategoryFPGAs (Field Programmable Gate Array)
SeriesKintex-7
Package-Case900-BBGA, FCBGA
Operating-Temperature-40°C ~ 100°C (TJ)
Mounting-TypeSurface Mount
Voltage-Supply0.97 V ~ 1.03 V
Supplier-Device-Package900-FCBGA (31x31)
IC Number of Gates-
Number-of-I-O500 I/O
Number-of-LABs-CLBs25475
Number-of-Logic-Elements-Cells326080
Total-RAM-Bits16404480 Bits
MfrAMD Xilinx
SeriesKintex®-7
PackageTray
Product-StatusActive
Total-RAM-Bits16404480
Number-of-I-O500
Voltage-Supply0.97V ~ 1.03V
Package-Case900-BBGA FCBGA
Base-Product-NumberXC7K325

Descriptions

IC FPGA 500 I/O 900FCBGA
Product Tags: Multiscene FPGA Integrated Circuit   FPGA Integrated Circuit Surface Mount   XC7K325T-2FFG900I  
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