Product Description
As a technical specialist, I confirm copper heat sinks are
fundamental for thermal management in electronic devices. Our
precision CNC machined copper alloy heat sinks, made from pure
copper base material, deliver thermal conductivity up to
401-412W/m·K, nearly double that of aluminum. These sinks
efficiently absorb heat from critical components like CPUs and GPUs
while maximizing surface area for heat dissipation. Copper's
oxidation resistance ensures longevity, with tests showing
corrosion rates as low as 0.0178mm/a in pH=8.5 water conditions,
outperforming steel by 20-40 times.
Key Features
- Advanced Thermal Management: Leverages copper's rapid heat transfer (412W/m·K) combined with
expanded surface designs
- Optimized Structure: Skiving technology enables 0.1mm thin fins with minimized pitch
for maximum density
- EMI Shielding: Optional graphite-copper composites provide 1750W/m·K horizontal
conductivity and electromagnetic protection
- Design Flexibility: Supports wave-like stamping (2mm adjustable pitch) or gradient
MIM manufacturing for specialized airflow
- Stable Base: Bases compressed under 60MPa pressure achieve 99%+ density for
minimal thermal resistance
Technical Parameters
| Parameter | Specification |
|---|
| Material | Pure Copper (C1100)/Copper Alloy (C1441/C1450) |
| Thermal Conductivity | 401-412W/m·K (Pure Copper) |
| Operating Temperature | -50℃ to 400℃ (Standard)/600℃ (Graphite Composite) |
| Thickness Range | 0.1-3.0mm (0.01mm precision customization available) |
| Density | 8.92g/cm³ (Pure Copper) |
| Surface Treatment | Anti-oxidation coating (PHPS) |
| Insulation | Optional 50-200μm resin layer, UL94V-0 rating |
Applications
- Consumer Electronics: Smartphone thermal modules, laptop CPU/GPU conduction pads
(replacing aging thermal paste)
- Industrial Equipment: Photovoltaic inverter skived heatsinks, communication base
station power modules
- Automotive Electronics: EV control system cooling modules, resistant to engine
compartment temperatures
- LED Lighting: High-power LED substrate cooling, extending lumen maintenance
- Specialized Fields: Medical imaging systems, aerospace control system thermal
management
Customization Services
We deliver end-to-end solutions: first analyzing airflow paths
(side/vertical flow) to determine heatsink morphology; then
employing dual-cavity MIM technology to create gradient structures
combining porous fins (50%-96% density) with high-density bases;
finally using trichloroethane solvent debinding and 700℃ hydrogen
sintering for structural integrity. Supports standard 15*15mm to
custom geometries with 7-10 day lead times.
Support & Services
Our engineering team provides thermal simulation to optimize fin
height and pitch. Batch orders include complimentary first-article
inspection reports with thermal resistance data. Post-sales support
includes on-site installation guidance and graphite-copper
composite recommendations for specialized environments.
